Sputtering apparatus including gas distribution system

• US 9,812,296 B2
• Filed: 02/02/2016
• Issued: 11/07/2017
• Est. Priority Date: 02/03/2015
• Status: Active Grant

• Current Assignee: Cardinal CG Company (Cardinal Glass Industries Incorporated)
• Original Assignee: Cardinal CG Company (Cardinal Glass Industries Incorporated)
• Inventors: Hartig, Klaus
• Primary Examiner(s): BAND, MICHAEL A
• Application Number:
  US15/013,120
• Publication Number:
  US 20160233056A1
• Time in Patent Office: 644 Days
• CPC Class Codes: C23C 14/0063 characterised by means for introducing or removing gases
• CPC Class Codes: C23C 14/14 Metallic material, boron or silicon
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: H01J 2237/006 Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece, H01J37/3244 takes precedence; environmental cells for electron microscopes H01J2237/2003; microscopes with environmental specimen chamber H01J2237/2608
• CPC Class Codes: H01J 2237/327 Arrangements for generating the plasma
• CPC Class Codes: H01J 2237/332 Coating
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01J 37/3405 Magnetron sputtering
• CPC Class Codes: H01J 37/3417 Arrangements
• CPC Class Codes: H01J 37/342 Hollow targets
• CPC Class Codes: H01J 37/3438 Electrodes other than cathode
• CPC Class Codes: H01J 37/3464 Operating strategies
• CPC Class Codes: H01J 37/347 Thickness uniformity of coated layers or desired profile of target erosion

Abstract

Some embodiments provide a magnetron sputtering apparatus including a vacuum chamber within which a controlled environment may be established, a target comprising one or more sputterable materials, wherein the target includes a racetrack-shaped sputtering zone that extends longitudinally along a longitudinal axis and comprises a straightaway area sandwiched between a first turnaround area and a second turnaround area, a gas distribution system that supplies a first gas mixture to the first turnaround area and/or the second turnaround area and supplies a second gas mixture to the straightaway area, wherein the first gas mixture reduces a sputtering rate relative to the second gas mixture. In some cases, the first gas mixture includes inert gas having a first atomic weight and the second gas mixture includes inert gas having a second atomic weight, wherein the second atomic weight is heavier than the first atomic weight.

Claims

1. A magnetron sputtering apparatus, comprising:

a vacuum chamber providing a controlled environment;

a cylindrical target comprising one or more sputterable materials, wherein the cylindrical target includes a sputtering zone that is racetrack shaped and extends longitudinally along a longitudinal axis, and the sputtering zone includes two straightaway areas sandwiched between first and second turnaround areas;

a gas distribution system comprising a plurality of interfaces extending along the longitudinal axis, wherein the plurality of interfaces includes a plurality of first interfaces and a plurality of second interfaces, the first interfaces positioned at each of the first and second turnaround areas to supply a first gas mixture to both of the first and second turnaround areas, such that the first gas mixture controls sputtering rate at localized areas of both of the first and second turnaround areas, whereas the second interfaces are positioned at each of the two straightaway areas to supply a second gas mixture to both of the two straightaway areas, such that the second gas mixture controls sputtering rate at localized areas of both of the two straightaway areas, the first interfaces positioned along first and third longitudinal distances, the second interfaces positioned along a second longitudinal distance, such that the first, second, and third longitudinal distances do not overlap;

wherein the first gas mixture is supplied to the first interfaces and the second gas mixture is supplied to the second interfaces, wherein the first gas mixture includes a single inert gas or two or more inert gases having a first atomic weight, and the second gas mixture includes a single inert gas or two or more inert gases having a second atomic weight, wherein the first atomic weight is an atomic weight of the single inert gas or an average atomic weight of the two or more inert gases in the first gas mixture and the second atomic weight is an atomic weight of the single inert gas or an average atomic weight of the two or more inert gases in the second gas mixture, and wherein the first atomic weight is different from the second atomic weight, the second atomic weight being heavier than the first atomic weight, the gas distribution system thereby providing more uniform sputtering rates across the first and second turnaround areas and the two straightaway areas than if only an argon gas atmosphere were provided to the first and second turnaround areas and the two straightaway areas, and wherein each of the first gas mixture and the second gas mixture is free of reactive gas.

2. The magnetron sputtering apparatus of claim 1 wherein the first gas mixture includes a single inert gas selected from the group consisting of argon, helium, neon, krypton, and xenon and the first atomic weight is an atomic weight of the single inert gas and/or the second gas mixture includes a single inert gas selected from the group consisting of argon, neon, krypton, xenon and radon and the second atomic weight is an atomic weight of the single inert gas.

3. The magnetron sputtering apparatus of claim 1 wherein at least one interface in the plurality of interfaces supplies gas at a continuous flow rate and/or at a continuous pressure.

4. The magnetron sputtering apparatus of claim 1 wherein the plurality of interfaces are part of a gas delivery member structure comprising one or more gas delivery members each positioned along a side of the cylindrical target.

5. The magnetron sputtering apparatus of claim 1 wherein the plurality of interfaces are part of a gas delivery member structure comprising a first gas delivery member positioned on a first side of the cylindrical target and a second gas delivery member positioned on an opposite side of the cylindrical target.

6. The magnetron sputtering apparatus of claim 1 wherein the first gas mixture is supplied to the first interfaces at a first gas pressure and the second gas mixture is supplied to the second interfaces at a second gas pressure, wherein the first gas pressure is substantially the same as the second gas pressure.

7. The magnetron sputtering apparatus of claim 1 wherein the gas distribution system includes an anodic gas distribution member that houses the first interfaces and receives a voltage that reduces a sputtering rate of the first turnaround area or the second turnaround area relative to a sputtering rate of the straightaway areas.

8. The magnetron sputtering apparatus of claim 1 wherein the first interfaces substantially surround at least a portion of the first turnaround area or the second turnaround area.

9. The magnetron sputtering apparatus of claim 1 wherein the plurality of interfaces further includes a third interface and a third gas mixture is supplied to the third interface and wherein the third gas mixture includes a single inert gas or two or more inert gases having a third atomic weight, wherein the third atomic weight is an atomic weight of the single inert gas or an average atomic weight of two or more inert gases and wherein the third atomic weight is different from each of the first atomic weight and the second atomic weight.

10. The magnetron sputtering apparatus of claim 9 wherein the second atomic weight is heavier than the first atomic weight and wherein the third atomic weight is heavier than the first atomic weight but lighter than the second atomic weight.

11. The magnetron sputtering apparatus of claim 9 wherein the first gas mixture is supplied to the first interfaces at a first gas pressure, the second gas mixture is supplied to the second interfaces at a second gas pressure and the third gas mixture is supplied to the third interface at a third gas pressure, wherein the first gas pressure, the second gas pressure and the third gas pressure are substantially the same.

12. The magnetron sputtering apparatus of claim 1 wherein the one or more sputterable materials of the cylindrical target comprise silver.

13. The magnetron sputtering apparatus of claim 1 wherein the one or more sputterable materials of the cylindrical target consist of silver.