Apparatus for molecular adhesion bonding with compensation for radial misalignment
First Claim
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1. An apparatus for bonding a first wafer onto a second wafer by molecular adhesion, the apparatus comprising:
- a microprocessor for calculating a predefined bonding curvature of the first wafer as a function of an initial radial misalignment between the first wafer and the second wafer, wherein the initial radial misalignment occurs as a result of different radial expansions of the first and second wafers;
a first holding support for holding the first wafer, wherein the first holding support comprises a jack for imposing the predefined bonding curvature on the first wafer;
a second holding support for holding the second wafer; and
a microcontroller for controlling the apparatus so that the second wafer is released from the second support before or while being brought in contact with the first wafer, so that the second wafer adapts to the bonding curvature imposed on the first wafer during the propagation of a bonding wave.
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Abstract
A method for bonding a first wafer onto a second wafer by molecular adhesion where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.
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Citations
20 Claims
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1. An apparatus for bonding a first wafer onto a second wafer by molecular adhesion, the apparatus comprising:
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a microprocessor for calculating a predefined bonding curvature of the first wafer as a function of an initial radial misalignment between the first wafer and the second wafer, wherein the initial radial misalignment occurs as a result of different radial expansions of the first and second wafers; a first holding support for holding the first wafer, wherein the first holding support comprises a jack for imposing the predefined bonding curvature on the first wafer; a second holding support for holding the second wafer; and a microcontroller for controlling the apparatus so that the second wafer is released from the second support before or while being brought in contact with the first wafer, so that the second wafer adapts to the bonding curvature imposed on the first wafer during the propagation of a bonding wave. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An apparatus for bonding a first wafer onto a second wafer by molecular adhesion, the apparatus comprising:
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a first holding support for holding the first wafer, wherein the first holding support comprises a jack for imposing a predefined bonding curvature on the first wafer; a second holding support for holding the second wafer; a microcontroller or logic elements to control the apparatus so that the second wafer is released from the second support before or while being brought in contact with the first wafer, so that the second wafer adapts to the bonding curvature imposed on the first wafer during the propagation of a bonding wave; and a microprocessor or microprocessor system for calculating the predefined bonding curvature or a radius of curvature corresponding to the predefined bonding curvature as the function of the initial radial misalignment, wherein the predefined bonding curvature is a function of an initial radial misalignment between the first wafer and the second wafer, wherein the initial radial misalignment occurs as a result of different radial expansions of the first and second wafers, wherein the microprocessor or microprocessor system receives sensor information that defines radial wafer misalignments between two bonded wafers from a same wafer batch as the first wafer and the second wafer and computes therefrom bonding curvature information and wafer displacement information, which information is sent to the microcontroller or logic elements, and wherein the microprocessor or the microprocessor system uses the radial wafer misalignments between the two bonded wafers as the initial radial misalignment.
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16. A wafer bonding apparatus for bonding a first wafer onto a second wafer by molecular adhesion, the apparatus comprising:
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a microprocessor for calculating a predefined bonding curvature of the first wafer as a function of an initial radial misalignment between the first wafer and the second wafer, wherein the initial radial misalignment occurs as a result of different radial expansions of the first and second wafers; a first holding support assembly including a first holding support configured to hold the first wafer, the first holding support assembly configured to impose the predefined bonding curvature on the first wafer; and a second holding support configured to hold the second wafer, wherein the apparatus is configured to release the second wafer from the second support before or while being brought into contact with the first wafer such that the second wafer adapts to the bonding curvature imposed on the first wafer by the first holding support while a bonding wave propagates between the first wafer and the second wafer. - View Dependent Claims (17, 18, 19, 20)
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Specification