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Thermal solutions for system-in-package assemblies in portable electronic devices

  • US 9,820,373 B2
  • Filed: 09/30/2014
  • Issued: 11/14/2017
  • Est. Priority Date: 06/26/2014
  • Status: Active Grant
First Claim
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1. An electronic device, comprising:

  • a substrate; and

    a system in package assembly comprising;

    a plurality of components, the plurality of components including a first component including a first surface mounted to the substrate and a second surface, andone or more thermal plugs including a first thermal plug mounted to the second surface of the first component, wherein a first surface of the first thermal plug directly contacts the second surface of the first component, and a second surface of the first thermal plug directly contacts a shielding layer,the shielding layer dissipating and spreading heat by the first thermal plug to the substrate, wherein the shielding layer is electrically connected to ground.

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