Radio IC device

• US 9,830,552 B2
• Filed: 08/12/2013
• Issued: 11/28/2017
• Est. Priority Date: 07/18/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Ishino, Satoshi, Kataya, Takeshi, Kimura, Ikuhei, Ikemoto, Nobuo, Dokai, Yuya
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): Hu, Jennifer F
• Application Number:
  US13/964,234
• Publication Number:
  US 20130334321A1
• Time in Patent Office: 1,569 Days
• Field of Search: 343702
• CPC Class Codes: G06K 19/06187 with magnetically detectable marking
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07773 Antenna details antennas for wireless devices, e.g. RFID tags, in general H01Q1/22
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2223/6655 Matching arrangements, e.g. arrangement of inductive and capacitive components
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/36 : Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/42 : Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H01Q 1/44 : using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H01Q 13/10 : Resonant slot antennas
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/16 : with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/30 : with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence
• CPC Class Codes: H05K 1/0216 : Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0239 : Signal transmission by AC coupling
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/10015 : Non-printed capacitor
• CPC Class Codes: H05K 2201/10022 : Non-printed resistor
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10371 : Shields or metal cases
• CPC Class Codes: H05K 2201/10522 : Adjacent components

Abstract

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

Claims

1. A radio IC device comprising:

a radio IC arranged to process transmitted and received signals;

a coil element electrically connected to or electromagnetically coupled to the radio IC; and

a radiation plate arranged so as to be coupled to the coil element;

wherein

the radiation plate is defined by a metal case of an apparatus, and a loop electrode defined by an edge of an opening in a planar portion of the metal case is provided in a portion of the metal case;

the coil element is coupled to the loop electrode of the metal case via a magnetic field; and

the metal case functions as the radiation plate such that the transmitted signals processed by the radio IC are radiated from the metal case and the received signals received by the metal case are processed by the radio IC.

2. The radio IC device according to claim 1, wherein the radiation plate includes a notch provided therein, and an edge of the radiation plate which is located around the notch defines the loop electrode.

3. The radio IC device according to claim 1, wherein the coil element is defined by a spiral electrode.

4. A radio IC device comprising:

a radio IC arranged to process transmitted and received signals;

a coil element electrically connected to or electromagnetically coupled to the radio IC; and

a radiation plate arranged so as to be coupled to the coil element;

wherein

the radiation plate is defined by a planar metal case of an apparatus;

the coil element is provided adjacent to an edge of the planar metal case such that one portion of the coil element overlaps with the edge of the planar metal case in planar view and another portion of the coil element is arranged outside of the planar metal case in planar view, and coupled to the planar metal case via a magnetic field generated by current flowing in the edge of the planar metal case; and

the planar metal case functions as the radiation plate such that the transmitted signals processed by the radio iC are radiated from the the radio IC.

5. The radio IC device according to claim 4, wherein the coil element is defined by a spiral electrode.