Conductive pattern laminate and electronic device comprising same

• US 9,841,857 B2
• Filed: 03/24/2014
• Issued: 12/12/2017
• Est. Priority Date: 03/22/2013
• Status: Active Grant

• Current Assignee: LG Chem Limited (LG Corporation)
• Original Assignee: LG Chem Limited (LG Corporation)
• Inventors: Hwang, Ji Young, Oh, Dong Hyun, Choi, Hang Suk, Lee, Seung Heon, Min, Sungjoon
• Primary Examiner(s): Eurice, Michael J
• Application Number:
  US14/778,462
• Publication Number:
  US 20160282982A1
• Time in Patent Office: 1,359 Days
• CPC Class Codes: G06F 1/1643 the display being associated to a digitizer, e.g. laptops that can be used as penpads details related to the relative motion of the display enclosure with respect to the body enclosure, e.g. to move between laptop and tablet PC configuration G06F1/1615
• CPC Class Codes: G06F 1/1652 the display being flexible, e.g. mimicking a sheet of paper, or rollable
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/147 using display panels
• CPC Class Codes: H05K 1/0296 Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 2201/0326 Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/16 by cathodic sputtering

Abstract

The present application provides a conductive pattern laminate including: a substrate having concave portions or protrusion portions on an upper surface thereof; and a conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate, in which the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other, a method for manufacturing the same, and an electronic apparatus including the laminate.

Claims

1. A conductive pattern laminate, comprising:

a substrate having concave portions and protrusion portions on an upper surface thereof; and

a conductive film provided on an upper surface of the concave portions and the protrusion portions of the substrate,

wherein the conductive film provided on the upper surface of the concave portions of the substrate and the conductive film provided on the upper surface of the protrusion portions of the substrate are electrically disconnected from each other; and

wherein an edge of the substrate is a decoration part and a central portion surrounded by the decoration part is an effective screen part; and

wherein the conductive film comprises two or more patterns electrically disconnected from each other by the concave portions and the protrusion portions, and at least a part of the two or more patterns comprise an effective screen region provided in the effective screen part and a router region provided in the decoration part and electrically connecting the effective screen region to a voltage application part; and

wherein a metal layer is provided on the router region of the conductive film provided in the decoration part.

2. The conductive pattern laminate of claim 1, wherein a depth of the concave portions or a height of the protrusion portions is larger than a thickness of the conductive film.

3. The conductive pattern laminate of claim 1, wherein a depth of the concave portions or a height of the protrusion portions is 0.1 to 30 μ

m.

4. The conductive pattern laminate of claim 1, wherein a taper angle of at least a part of the concave portions or the protrusion portions is 60 or more degrees.

5. The conductive pattern laminate of claim 1, wherein the concave portions comprise two or more concave portions which are different in depth, and

the protrusion portions comprise two or more protrusion portions which are different in height.

6. The conductive pattern laminate of claim 1, wherein the concave portions and the protrusion portions are provided in a form that the conductive film is separated into two or more patterns which are electrically disconnected from each other.

7. The conductive pattern laminate of claim 1, wherein the conductive film comprises two or more patterns electrically disconnected from each other by the concave portions and the protrusion portions, and

at least a part of the two or more patterns have a form extended to a voltage application part.

8. The conductive pattern laminate of claim 1, wherein a depth of the concave portions or a height of the protrusion portions is larger than a sum of a height of the conductive film and a height of the additional conductive layer.

9. The conductive pattern laminate of claim 1, wherein the conductive film is provided over an entire region of the upper surface of the substrate.

10. The conductive pattern laminate of claim 1, wherein the substrate is a resin substrate.

11. The conductive pattern laminate of claim 10, wherein the resin substrate is a UV-curable resin substrate.

12. The conductive pattern laminate of claim 1, wherein in a portion in which the router regions are excluded in the decoration part on the upper surface of the substrate, the conductive film is electrically disconnected from the voltage application part by the concave portions and the protrusion portions.

13. The conductive pattern laminate of claim 12, wherein a decoration layer is provided over the entire region of the upper surface of the conductive film provided in the decoration part.

14. The conductive pattern laminate of claim 13, wherein a depth of the concave portions or a height of the protrusion portions is larger than a sum of a thickness of the conductive film and a thickness of the decoration layer.

15. The conductive pattern laminate of claim 13, wherein a depth of the concave portions or a height of the protrusion portions is larger than a sum of a thickness of the conductive film, a thickness of the metal layer and a thickness of the decoration layer.

16. The conductive pattern laminate of claim 13, wherein the decoration layer is a darkened layer of the metal layer.

17. An electronic apparatus comprising one or more of the conductive pattern laminate of claim 1.

18. A touch screen comprising one or more of the conductive pattern laminate of claim 1.

19. A method for manufacturing a conductive pattern laminate, the method comprising:

preparing a substrate comprising concave portions and protrusion portions;

forming a conductive film having a thickness less than a depth of the concave portions or a height of the protrusion portions over an entire region of an upper surface of the substrate;

protecting a portion in which an edge of the substrate on which the conductive film is formed is excluded with a protective film; and

forming a metal layer on the edge.

20. The method of claim 19, further comprising:

forming a decoration layer on the metal layer.

21. The method of claim 19, further comprising:

removing the protective film.