Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof

• US 9,850,401 B2
• Filed: 12/04/2014
• Issued: 12/26/2017
• Est. Priority Date: 12/05/2013
• Status: Active Grant

• Current Assignee: Taimide Technology Incorporation
• Original Assignee: Taimide Technology Incorporation
• Inventors: Lai, Chung-Ting, Lin, Chih-Wei
• Primary Examiner(s): Lee, Doris
• Application Number:
  US14/561,070
• Publication Number:
  US 20150159043A1
• Time in Patent Office: 1,118 Days
• Field of Search: 428213
• CPC Class Codes: B32B 2038/0016 Abrading
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2255/205 Metallic coating
• CPC Class Codes: B32B 2307/306 Resistant to heat
• CPC Class Codes: B32B 2307/714 Inert, i.e. inert to chemical degradation, corrosion
• CPC Class Codes: B32B 2311/00 Metals, their alloys or their compounds
• CPC Class Codes: B32B 2379/08 Polyimides
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/20 using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 27/281 comprising polyimides
• CPC Class Codes: B32B 27/322 comprising halogenated polyolefins, e.g. PTFE
• CPC Class Codes: C03C 17/3405 with at least two coatings of organic materials C03C17/36, C03C17/42 take precedence
• CPC Class Codes: C03C 17/38 at least one coating being a coating of an organic material
• CPC Class Codes: C08G 73/1039 comprising halogen-containing substituents
• CPC Class Codes: C08G 73/1042 Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
• CPC Class Codes: C08G 73/1053 with oxygen only in the tetracarboxylic moiety
• CPC Class Codes: C08G 73/1071 Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08L 27/18 Homopolymers or copolymers or tetrafluoroethene
• CPC Class Codes: C08L 83/04 : Polysiloxanes
• CPC Class Codes: C09D 179/08 : Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: H05K 1/036 : Multilayers with layers of different types
• CPC Class Codes: H05K 2201/015 : Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
• CPC Class Codes: H05K 2201/0154 : Polyimide
• CPC Class Codes: H05K 2201/0212 : Resin particles
• CPC Class Codes: H05K 3/022 : Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: H05K 3/381 : by special treatment of the substrate
• CPC Class Codes: Y10T 428/2495 : Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/254 : Polymeric or resinous material
• CPC Class Codes: Y10T 428/259 : Silicic material
• CPC Class Codes: Y10T 428/31544 : Addition polymer is perhalogenated

Abstract

A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.

Claims

1. A multilayered polyimide film comprising:

a first polyimide layer incorporating fluorine-containing polymer particles, and having a first surface and a second surface; and

a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface, the second and the third polyimide layers respectively containing organic silicon oxygen compound particles;

wherein the multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/°

C.

2. The multilayered polyimide film according to claim 1, wherein the first polyimide layer has a thickness h1, the second polyimide layer has a thickness h2, and the ratio h2/h1 is about 1/6 or less.

3. The multilayered polyimide film according to claim 1, wherein a total thickness of the multilayered polyimide film is about 80 μ

m or less.

4. The multilayered polyimide film according to claim 1, wherein the fluorine-containing polymer particles are about 10 to about 45 wt % of the first polyimide layer.

5. The multilayered polyimide film according to claim 1, wherein the fluorine-containing polymer is selected from a group consisting of polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), fluorinated ethylene propylene (FEP), chlorotrifluoroethylene (CTFE), ethylene chlorotrifuloroethylene (ECTFE) and polyfluorinated vinylidene (PVDF).

6. The multilayered polyimide film according to claim 1, wherein the fluorine-containing polymer particles have an average particle diameter between about 1 and about 5 μ

m.

7. The multilayered polyimide film according to claim 1, wherein the organic silicon oxygen compound particles have an average particle diameter between about 1 and about 100 nm.

8. The multilayered polyimide film according to claim 1, wherein the second polyimide layer contains a polyimide polymer formed by a condensation reaction applied on diamine and dianhydride monomers, wherein:

the diamine monomers are 2,2′

-dimethyl[1,1′

-biphenyl]-4,4′

-diamine (m-TB-HG) or 2,2′

-Bis(trifluoromethyl)benzidine (TFMB); and

the dianhydride monomers are selected either from a group consisting of a group (C), or from at least one monomer species of the group (C) and at least one monomer species of a group (D) with the dianhydride monomers selected from the group (D) having a total number of moles equal to 0.45 or less,

the group (C) including pyromellitic dianhydride (PMDA) and 3,3 ′

,4,4′

-biphenyltetracarboxylic dianhydride (BPDA), and

the group (D) including 2,2-bis[4-(3,4dicarboxyphenoxy)phenyl]propane dianhydride (BPADA), 2,2′

-bis-(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), 4,4-oxydiphthalic anhydride (ODPA), benzophenonetetracarboxylic dianhydride (BTDA) and 3,3′

,4,4′

-dicyclohexyltetracarboxylic acid dianhydride (HBPDA).

9. The multilayered polyimide film according to claim 1, wherein the second polyimide layer has a polyimide polymer formed by a condensation reaction applied on diamine and dianhydride monomers, the diamine monomers are phenylenediamine (p-PDA), and the dianhydride monomers are selected from a group consisting of BPDA, BPADA, 6FDA, ODPA, BTDA and HBPDA.

10. The multilayered polyimide film according to claim 1, wherein the second polyimide layer has a polyimide polymer formed by a condensation reaction applied on diamine and dianhydride monomers, wherein:

the diamine monomers are selected from a group consisting of a group (B);

oxydianiline (ODA), 1,3 -bis(4-aminophenoxy)benzene (TPER), 1,4-bis(4-aminophenoxy)benzene (TPEQ), 1,3′

-bis(3-aminophenoxy)benzene (APBN), 3,5-diaminobenzotrifluoride (DABTF), and 2,2′

-bis[4-(4-aminophenoxy)phenyl]propane (BAPP); and

the dianhydride monomers are selected from at least one monomer species of a group (C) and at least one monomer species of a group (D), wherein the group (C) includes PMDA and BPDA, and the group (D) includes BPADA, 6FDA, ODPA, HBPDA and BTDA;

wherein the diamine monomers selected from the group (B) have a total number of moles “

b”

, the dianhydride monomers selected from the group (D) have a total number of moles “

d”

, and the sum b+d is less than 0.9.

11. The multilayered polyimide film according to claim 1, wherein the second polyimide layer has a polyimide polymer formed by a condensation reaction applied on diamine and dianhydride monomers, wherein:

the diamine monomers are selected from at least one monomer species of a group (A) and at least one monomer species of a group (B), the group (A) including PDA, m-TB-HG, 6-amino-2-(4-aminophenyl)benzoxazole (6PBOA), 5-amino-2-(4-aminophenyl)benzoxazole (5PBOA) and TFMB, and the group (B) including ODA, TPER, TPEQ, APBN, DABTF and BAPP; and

the dianhydride monomers are selected from at least one monomer species of a group (C) and at least one monomer species of a group (D), the group (C) including PMDA and BPDA, and the group (D) including BPADA, 6FDA, ODPA, HBPDA and BTDA;

wherein the diamine monomers selected from the group (B) have a total number of moles “

b”

, the dianhydride monomers selected from the group (D) have a total number of moles “

d”

, and the sum b+d is less than 0.9.

12. The multilayered polyimide film according to claim 1, wherein a dielectric constant of the multilayered polyimide film is less than 3.2, and a dissipation factor of the multilayered polyimide film is less than 0.012.

13. The multilayered polyimide film according to claim 1, wherein the first polyimide layer has a CTE value between 15 and 30 ppm/°

C., and the second polyimide layer has a CTE value between 5 and 60 ppm/°

C.