Thermally-conductive polycarbonate resin composition and molded product formed therefrom

  • US 9,862,870 B2
  • Filed: 12/02/2013
  • Issued: 01/09/2018
  • Est. Priority Date: 08/23/2013
  • Status: Active Grant
First Claim
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1. A thermally conductive polycarbonate resin composition, comprising:

  • (A) a polycarbonate resin, (B) thermally conductive fillers, (C) 0.1 parts by weight to 5 parts by weight of a modified polyolefin copolymer, and (D) 0.1 parts by weight to 5 parts by weight of a low molecular weight polyolefin resin having a weight average molecular weight of 1,000 g/mol to 10,000 g/mol, wherein the amounts of (C) modified polyolefin copolymer and (D) low molecular weight polyolefin resin are based on 100 parts by weight of a base resin comprising 20 wt % to 40 wt % of the polycarbonate resin (A) and 60 wt % to 80 wt % of the thermally conductive fillers (B),wherein the thermally conductive fillers (B) are spherical fillers having an average particle diameter of 30 μ

    m to 80 μ

    m.

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