LED package with encapsulant having planar surfaces
DCFirst Claim
1. A lighting package, comprising:
- a solid state light source on a submount;
a wavelength conversion material layer covering less than all of said solid state light source or less than all of the top surface of said submount;
an encapsulant over said submount, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source.
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Abstract
LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility in using the packages in different applications.
87 Citations
20 Claims
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1. A lighting package, comprising:
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a solid state light source on a submount; a wavelength conversion material layer covering less than all of said solid state light source or less than all of the top surface of said submount; an encapsulant over said submount, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A lighting package, comprising:
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a solid state light source on a submount; a wavelength conversion material layer covering at least a portion of said solid state light source and/or at least a portion of the top surface of said submount; an encapsulant over said submount, said encapsulant having two or more sets of opposing planar surfaces reflecting at least some light from said light source.
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14. A lighting package, comprising:
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a solid state light source on a submount; a wavelength conversion material layer covering at least a portion of said solid state light source and/or at least a portion of the top surface of said submount; an encapsulant over said submount, said encapsulant having flat top reflecting at least some light from said light source.
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15. A lighting package, comprising:
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an array of interconnected solid state light sources on a submount; a wavelength conversion material layer covering one or more of said solid state light sources; an encapsulant over said submount, said encapsulant having one or more planar surfaces, wherein said planar surfaces cause total internal reflection (TIR) of at least some light from said light source. - View Dependent Claims (16, 17, 18)
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19. A lighting package, comprising:
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a solid state light source on a submount; a wavelength conversion material layer covering less than all of said solid state light source and/or less than all of the top surface of said submount, wherein said conversion material layer comprises a single phosphor or blend of a plurality of phosphors; an encapsulant over said submount, said encapsulant having one or more planar surfaces, wherein only a portion of light from said light source passes out of said encapsulant on its first pass. - View Dependent Claims (20)
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Specification