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Stacked semiconductor chip RGBZ sensor

  • US 9,876,050 B2
  • Filed: 11/23/2016
  • Issued: 01/23/2018
  • Est. Priority Date: 12/22/2014
  • Status: Active Grant
First Claim
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1. An apparatus, comprising:

  • a first semiconductor chip having a first pixel array, said first pixel array having visible light sensitive pixels; and

    ,a second semiconductor chip having a second pixel array, said first semiconductor chip stacked on said second semiconductor chip such that said second pixel array resides beneath said first pixel array, said second pixel array having IR light sensitive pixels for time-of-flight based depth detection, wherein, an IR sensitive pixel resides directly beneath one or more of the visible light sensitive pixels such that incident IR light received by the IR sensitive pixel passes through the one or more visible light pixels, and wherein, first interconnect metallization of the first semiconductor chip faces second interconnect metallization of the second semiconductor chip only outside respective surface areas of the first pixel array and the second pixel array where frontside light guide structures of the first pixel array and frontside light guide structures of the second pixel array couple incident light that flows through the visible light sensitive pixels of the first pixel array into the IR light sensitive pixels of the second pixel array.

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