Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate

  • US 9,881,802 B2
  • Filed: 01/31/2013
  • Issued: 01/30/2018
  • Est. Priority Date: 11/22/2010
  • Status: Active Grant
First Claim
Patent Images

1. A slurry comprising abrasive grains and water,the abrasive grains including a hydroxide of tetravalent cerium, and the abrasive grains including a property of producing a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.59×

  • 105 G.

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