LED chip having ESD protection

• US 9,893,051 B2
• Filed: 07/10/2014
• Issued: 02/13/2018
• Est. Priority Date: 07/10/2013
• Status: Active Grant

• Current Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Original Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Inventors: Lee, Seom Geun, Yoon, Yeo Jin, Kim, Jae Kwon, Lee, So Ra, Yang, Myoung Hak
• Primary Examiner(s): Fan, Bo
• Application Number:
  US14/991,829
• Publication Number:
  US 20160218096A1
• Time in Patent Office: 1,314 Days
• Field of Search: 257767, 257737, 438703, 438614
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/0255 using diodes as protective elements
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Disclosed herein is a light emitting diode chip having ESD protection. An exemplary embodiment provides a flip-chip type light emitting diode chip, which includes a light emitting diode part aligned on a substrate, and a reverse-parallel diode part disposed on the substrate and connected to the light emitting diode part. Within the flip-chip type light emitting diode chip, the light emitting diode part is placed together with reverse-parallel diode part, thereby providing a light emitting diode chip exhibiting strong resistance to electrostatic discharge.

Claims

1. A flip-chip type light emitting diode chip comprising:

a substrate;

a light emitting diode part aligned on the substrate;

a reverse-parallel diode part aligned on the substrate and connected to the light emitting diode part;

an insulation layer covering the light emitting diode part and the reverse-parallel diode part;

a first electrode pad aligned on the light emitting diode part; and

a second electrode pad aligned over the light emitting diode part and the reverse-parallel diode part,

wherein each of the light emitting diode part and the reverse-parallel diode part comprises;

a first conductive type nitride-based semiconductor layer;

a second conductive type nitride-based semiconductor layer; and

an active layer placed between the first conductive type nitride-based semiconductor layer and the second conductive type nitride-based semiconductor layer, and

wherein the first electrode pad is electrically connected to the first conductive type semiconductor layer of the light emitting diode part and the second conductive type semiconductor layer of the reverse-parallel diode part, and

wherein the second electrode pad electrically connected to the first conductive type semiconductor layer of the reverse-parallel diode part and the second conductive type semiconductor layer of the light emitting diode part through the insulation layer.

2. The flip-chip type light emitting diode chip of claim 1, wherein the reverse-parallel diode part is located in the middle of an edge of the substrate.

3. The flip-chip type light emitting diode chip of claim 1, wherein the light emitting diode part is formed to surround at least a portion of the reverse-parallel diode part.

4. The flip-chip type light emitting diode chip of claim 1, wherein the reverse-parallel diode part has a polygonal shape having four sides and the light emitting diode part surrounds three sides of the reverse-parallel diode part.

5. The flip-chip type light emitting diode chip of claim 1, wherein the second electrode pad is electrically connected to the second conductive type semiconductor layer of the light emitting diode part and the first conductive type semiconductor layer of the reverse-parallel diode part.

6. The flip-chip type light emitting diode chip of claim 1, further comprising:

a reflective electrode aligned on the second conductive type nitride-based semiconductor layer of the light emitting diode part,

wherein the first electrode pad is placed on the reflective electrode.

7. The flip-chip type light emitting diode chip of claim 6, further comprising:

a current dispersion layer placed between the reflective electrode and the first electrode pad, and electrically connected to the first conductive type nitride-based semiconductor layer of the light emitting diode part and the second conductive type nitride-based semiconductor layer of the reverse-parallel diode part,

the current dispersion layer being insulated from the reflective electrode.

8. The flip-chip type light emitting diode chip of claim 7, wherein the current dispersion layer covers the light emitting diode part and the reverse-parallel diode part, and has an opening which exposes the reflective electrode on the light emitting diode part, and an opening which exposes the first conductive type nitride-based semiconductor layer of the reverse-parallel diode part.

9. The flip-chip type light emitting diode chip of claim 8, wherein the reflective electrode and the first conductive type nitride-based semiconductor layer exposed through the openings of the current dispersion layer are electrically connected to each other by the second electrode pad.

10. The flip-chip type light emitting diode chip of claim 1, wherein the reverse-parallel diode part comprises two diodes connected in opposite directions.

11. The flip-chip type light emitting diode chip of claim 10, wherein the two diodes are disposed such that cathodes of the two diodes face each other.

12. The flip-chip type light emitting diode chip of claim 10, wherein the two diodes share a cathode.

13. The flip-chip type light emitting diode chip of claim 10, further comprising:

a first electrode pad aligned on the light emitting diode part; and

a second electrode pad aligned over the light emitting diode part and the reverse-parallel diode part.

14. The flip-chip type light emitting diode chip of claim 13, wherein each of the light emitting diode part and the reverse-parallel diode part comprises:

a first conductive type nitride-based semiconductor layer;

a second conductive type nitride-based semiconductor layer; and

an active layer placed between the first conductive type nitride-based semiconductor layer and the second conductive type nitride-based semiconductor layer, and

wherein the first electrode pad is electrically connected to the first conductive type semiconductor layer of the light emitting diode part and the second conductive type semiconductor layer of one of the two diodes.

15. The flip-chip type light emitting diode chip of claim 14, wherein the second electrode pad is electrically connected to the second conductive type semiconductor layer of the light emitting diode part and the second conductive type semiconductor layer of the other one of the two diodes.