Light emitter components, systems, and related methods

• US 9,897,267 B2
• Filed: 03/15/2013
• Issued: 02/20/2018
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Joo, Sung Chul, Welch, Erin, Andrews, Peter Scott, Clark, Joseph G., Edmond, John A., Reiherzer, Jesse C.
• Primary Examiner(s): Dzierzynski, Evan
• Application Number:
  US13/838,654
• Publication Number:
  US 20140268728A1
• Time in Patent Office: 1,803 Days
• Field of Search: 362225, 36221705, 36221701, 362221, 36224906, 29825
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.

Claims

1. A light emitter component, comprising:

an elongated substrate having first and second ends opposing each other along a length of the substrate, wherein the length of the substrate is greater than a width of the substrate;

a first trace and a second trace provided on a surface of the substrate, the first trace being disposed proximate the first end of the substrate and the second trace being disposed proximate the second end of the substrate, wherein the first trace and the second trace are spaced apart a distance that is greater than the width of the substrate, and wherein no other trace is disposed on the substrate between the first and second traces; and

a string of LED chips provided on the substrate, wherein the string of LED chips is disposed between the first and second ends of the substrate.

2. The component of claim 1, wherein a majority of the LED chips are spaced apart from the first trace by approximately 2 millimeters (mm) or more.

3. The component of claim 1, wherein the first trace and the second trace are provided only at the outermost opposing ends of the elongated substrate.

4. The component of claim 1, wherein the first trace is configured to overlap a portion of a first adjacent substrate.

5. The component of claim 4, wherein the second trace is configured to overlap a portion of a second adjacent substrate.

6. The component of claim 1, wherein the first and second traces comprise a flexible material.

7. The component of claim 1, wherein the first and second traces comprise an adhesive layer between the first and/or second traces and the substrate.

8. The component of claim 1, wherein the substrate comprises a ceramic material.

9. The component of claim 1, wherein the substrate comprises a length of approximately 20 mm or more.

10. The component of claim 1, wherein the substrate comprises a length of approximately 80 mm or more.

11. The component of claim 1, wherein the string of LED chips is serially connected between the first trace and the second trace.

12. The component of claim 1, wherein the string of LED chips comprises 10 or more LED chips.

13. The component of claim 1, wherein the string of LED chips comprises 20 or more LED chips.

14. The component of claim 1, wherein a bus wire extends along a portion of the elongated substrate.

15. The component of claim 14, wherein the bus wire is disposed on a back side of the substrate which opposes the string of LED chips.

16. The component of claim 1, wherein a separate conductive foil area is disposed over the surface of the substrate and extends between portions of the first and second trace.

17. The component of claim 1, further comprising at least one insulation displacement connector (IDC) disposed on the substrate.

18. The component of claim 17, wherein a first IDC is disposed over the first trace and a second IDC is disposed over the second trace.

19. The component of claim 17, wherein the IDC is disposed on a back side of the substrate which opposes the string of LED chips.

20. The component of claim 1, wherein the first trace and the second trace each comprise on the surface of the substrate a first attachment portion, a second attachment portion, and an intervening attachment portion disposed therebetween.

21. The component of claim 1, wherein each of the first trace and the second trace comprise a length that is less than approximately one half of an overall length of the substrate.

22. The component of claim 1, wherein each of the first trace and the second trace comprise a length that is less than approximately one quarter of an overall length of the substrate.

23. A light emitter component comprising:

a substrate;

a first trace and a second trace provided on a surface of the substrate; and

a string of LED chips provided on the substrate;

wherein portions of the substrate that are disposed between the first trace and the second trace are devoid of one or more additional traces disposed thereon;

wherein a majority of the LED chips are spaced apart from the first trace by approximately 2 millimeters (mm) or more;

wherein the substrate comprises a rectangular substrate having a length that measures greater than a width;

wherein the first trace and the second trace are provided at outermost opposing ends of the length; and

wherein the first trace and the second trace are spaced apart a distance that is greater than the width of the substrate.

24. The component of claim 23, wherein a majority of the LED chips are spaced apart from the first trace by approximately 5 millimeters (mm) or more.

25. The component of claim 23, wherein length is 20 millimeters (mm) or more.

26. The component of claim 25, wherein the width is 5 millimeters (mm) or more.

27. The component of claim 23, wherein the substrate comprises a ceramic material.

28. The component of claim 23, wherein the length is approximately 80 mm or more.

29. The component of claim 23, wherein the string of LED chips is serially connected between the first trace and the second trace.

30. The component of claim 23, wherein the string of LED chips comprises 20 or more LED chips.

31. The component of claim 23, wherein a bus wire extends along a portion of the elongated substrate.

32. The component of claim 31, wherein the bus wire is disposed on a back side of the substrate which opposes the string of LED chips.

33. The component of claim 23, wherein a separate conductive foil area is disposed over the surface of the substrate and extends between portions of the first and second trace.

34. The component of claim 23, further comprising at least one insulation displacement connector (IDC) disposed on the substrate.

35. The component of claim 34, wherein a first IDC is disposed over the first trace and a second IDC is disposed over the second trace.

36. The component of claim 34, wherein the IDC is disposed on a back side of the substrate which opposes the string of LED chips.

37. The component of claim 23, wherein the first and second traces comprise a flexible tape.

38. The component of claim 23, wherein the first and second traces comprise an adhesive layer between the first and/or second traces and the substrate.

39. A method of providing a light emitter component, the method comprising:

providing an elongated substrate having a first end and a second end opposing each other along a length of the substrate, wherein the length of the substrate is greater than a width of the substrate;

providing a first trace and a second trace on a surface of the substrate, the first trace being disposed proximate the first end of the substrate and the second trace being disposed proximate the second end of the substrate, wherein the first trace and the second trace are spaced apart a distance that is greater than the width of the substrate, and wherein no other trace is disposed on the substrate between the first and second traces; and

providing a string of LED chips on the substrate, wherein the string of LED chips is disposed between the first and second ends of the substrate.

40. The method of claim 39, wherein providing the first trace comprises providing a first trace that overlaps a portion of the elongated substrate.

41. The method of claim 39, wherein providing the first trace comprises applying an adhesive layer of the first trace over a portion of the elongated substrate.

42. The method of claim 39, wherein providing the elongated substrate comprises providing a ceramic substrate.

43. The method of claim 39, wherein providing the string of LED chips comprises providing a majority of LED chips that spaced apart from the first trace by approximately 2 millimeters (mm) or more.

44. The method of claim 39, further comprising providing a bus wire along a portion of the substrate.

45. The method of claim 39, further comprising providing an insulation displacement connector (IDC) over a portion of at least one of the first and second traces.

46. The method of claim 39, further comprising providing an insulation displacement connector (IDC) over backside of the substrate on a surface opposing the string of LED chips.