Quadrature compensation

• US 9,897,447 B2
• Filed: 10/28/2014
• Issued: 02/20/2018
• Est. Priority Date: 11/01/2013
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Blomqvist, Anssi, PIIRAINEN, Tommi, RYTKONEN, Ville Pekka
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US14/525,272
• Publication Number:
  US 20160153781A1
• Time in Patent Office: 1,211 Days
• Field of Search: 7351412, 7350402, 7350414, 7351432
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01C 19/5726 Signal processing

Abstract

A microelectromechanical sensor device that comprises a seismic mass, and a spring structure that defines for the seismic mass a drive direction, and a sense direction that is perpendicular to the drive direction. A capacitive transducer structure includes a stator to be anchored to a static support structure, and a rotor mechanically connected to the seismic mass. The capacitive transducer structure is arranged into a slanted orientation where a non-zero angle is formed between the drive direction and a tangent of the stator surface. The slated capacitive transducer structure creates an electrostatic force to decrease quadrature error of the linear oscillation.

Claims

1. A microelectromechanical sensor device, comprising:

a seismic mass;

a spring structure for suspending the seismic mass into a static support structure, wherein the spring structure defines for the seismic mass a drive direction, and a sense direction that is perpendicular to the drive direction;

an excitation element for driving the seismic mass into a linear drive oscillation, the drive oscillation having a direction which has a primary component in the drive direction and a secondary component by quadrature error in the sense direction;

a sense element for sensing a movement of the seismic mass because of a Coriolis force resulting from angular motion of the microelectromechanical sensor device;

a capacitive transducer structure that includes;

a stator to be anchored to the static support structure, wherein the stator includes a slanted first stator element and a slanted second stator element,

a rotor mechanically connected to the seismic mass, wherein the rotor includes a first rotor element positioned opposite the first stator element, and a second rotor element positioned opposite the second stator element, wherein the first rotor element and the first stator element form a first capacitive transducer in which capacitance increases in phase with displacements of a drive direction oscillation, and the second rotor element and the second stator element form a second capacitive transducer in which capacitance increases in opposite phase with displacements of the drive direction oscillation; and

an electrical energy source connected to create a voltage between the stator and the rotor,

wherein a first electrostatic force directed against the secondary component of the linear drive oscillation is created between the first stator element and the first rotor element of the first capacitive transducer, a second electrostatic force directed against the secondary component of the linear drive oscillation is created between the second stator element and the second rotor element of the second capacitive transducer, and the first electrostatic force is opposite to the second electrostatic force, and

wherein the first capacitive transducer and the second capacitive transducer are configured into a slanted orientation in which a non-zero angle is formed between the drive direction and a tangent of the slanted first stator element, wherein the non-zero angle is formed between the drive direction and a tangent of the slanted second stator element, and the slanted first stator element and the slanted second stator element are parallel, whereby the first electrostatic force against the secondary component of the linear drive oscillation becomes gap modulated in phase with displacements of the drive direction oscillation, and the second electrostatic force against the secondary component of the linear drive oscillation becomes gap modulated in opposite phase with displacements of the drive direction oscillation.

2. A microelectromechanical sensor device of claim 1, wherein the first stator element and the first rotor element of the first capacitive transducer are planar or curved, or the second stator element and the second rotor element of the second capacitive transducer are planar or curved.

3. A microelectromechanical sensor device of claim 1, wherein the first rotor element and the second rotor element are parallel to the first stator element and the second stator element.

4. A microelectromechanical sensor device of claim 1, wherein at least one of the first capacitive transducer or the second capacitive transducer further comprises at least one rotor comb finger that includes an elongate rotor surface.

5. A microelectromechanical sensor device of claim 4, wherein at least one of the first capacitive transducer or the second capacitive transducer further comprises a stator comb finger that includes an elongate stator surface, positioned such that the elongate stator surface extends opposite the elongate rotor surface.

6. A microelectromechanical sensor device of claim 4, wherein each of the first capacitive transducer and the second capacitive transducer includes at least one rotor comb finger, and a pair of a rotor comb finger of the first capacitive transducer and a rotor comb finger of the second capacitive transducer that project to opposite directions from the seismic mass.

7. A microelectromechanical sensor device of claim 1, wherein the first capacitive transducer includes one stator comb finger providing the first stator element for the first rotor element of one of a plurality of rotor comb fingers, and the second capacitive transducer includes another stator comb finger providing the second stator element for the second rotor element of one of the rotor comb fingers in the opposite lateral position of the drive oscillation of the seismic mass.

8. A microelectromechanical sensor device of claim 7, wherein

the first rotor element and the second rotor element of a pair of rotor comb fingers are in parallel.

9. A microelectromechanical sensor device of claim 5, wherein

the capacitive transducer structure includes a third capacitive transducer;

the first capacitive transducer includes a first pair of stator and rotor comb fingers;

the third capacitive transducer includes a third pair of stator and rotor comb fingers;

the stator surface of the stator comb finger of the first capacitive transducer, and the rotor surface of the rotor comb finger of the first capacitive transducer are parallel and slanted by a positive non-zero angle in respect of the drive direction;

the stator surface of the stator comb finger of the third capacitive transducer, and the rotor surface of the rotor comb finger of the third capacitive transducer are parallel and slanted by a negative non-zero angle in respect of the drive direction.

10. A microelectromechanical sensor device of claim 9, wherein

the capacitive transducer structure comprises four pairs of stator and rotor comb fingers;

the second capacitive transducer includes a second pair of stator and rotor comb fingers;

a fourth capacitive transducer includes a fourth pair of stator and rotor comb fingers;

the similarly slanted first capacitive transducer and the fourth capacitive transducer are in one lateral position of the drive oscillation of the seismic mass, and the similarly slanted second capacitive transducer and the third capacitive transducer are in another lateral position of the drive oscillation of the seismic mass.

11. A microelectromechanical sensor device of claim 9, wherein at least one of the rotor comb finger of the first capacitive transducer or the third capacitive transducer is formed of one tapered rotor comb finger element that includes a rotor surface slanted by the positive non-zero angle in respect of the drive direction, and a rotor surface slanted by the negative non-zero angle in respect of the drive direction.

12. A microelectromechanical sensor device of claim 5, wherein in the first capacitive transducer or in the second capacitive transducer, the stator and rotor comb fingers are configured in pairs into the slanted orientation such that:

in a stator comb finger of the stator and rotor comb finger pair, the stator surface that forms a side of the non-zero angle to the drive direction is planar and extends to the whole length of the stator comb finger;

in a rotor comb finger of the stator and rotor comb finger pair, the rotor surface is planar and is aligned parallel to the stator surface;

the opposite sides of the stator comb finger and the rotor comb finger are aligned with the drive direction, forming a non-symmetric sawtooth-shaped compensation structure.

13. A microelectromechanical sensor device of claim 1, wherein the non-zero angle is in the range of 0.5-2°

.