Meandering interconnect on a deformable substrate
First Claim
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1. An apparatus comprising:
- a first plurality of first conductive lines; and
a first meandering interconnect supported in a spaced relationship from a deformable substrate, wherein the first meandering interconnect comprises a first multiplicity of meandering conductive lines each of which is electrically connected to one of the first plurality of first conductive lines.
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Abstract
An apparatus including a first plurality of first conductive lines; and a first meandering interconnect supported in a spaced relationship from a deformable substrate, wherein the first meandering interconnect includes a first multiplicity of meandering conductive lines each of which is electrically connected to one of the first plurality of first conductive lines.
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20 Claims
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1. An apparatus comprising:
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a first plurality of first conductive lines; and a first meandering interconnect supported in a spaced relationship from a deformable substrate, wherein the first meandering interconnect comprises a first multiplicity of meandering conductive lines each of which is electrically connected to one of the first plurality of first conductive lines. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method comprising:
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supporting a first meandering interconnect in a spaced relationship from a deformable substrate, wherein the first meandering interconnect comprises a first multiplicity of meandering distinct conductive lines; and electrically connecting each of the meandering distinct conductive lines to one of a first plurality of first conductive lines.
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Specification