Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

  • US 9,932,497 B2
  • Filed: 03/26/2013
  • Issued: 04/03/2018
  • Est. Priority Date: 05/22/2012
  • Status: Active Grant
First Claim
Patent Images

1. A slurry comprising:

  • abrasive grains; and

    water, whereinthe abrasive grains include a hydroxide of a tetravalent metal element, produce absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grains adjusted to 1.0 mass %, and produce a liquid phase having a content of a non-volatile component of 300 ppm or more when centrifuging an aqueous dispersion having a content of the abrasive grains adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×

    105 G.

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