Thermal print head

• US 9,937,729 B2
• Filed: 12/21/2016
• Issued: 04/10/2018
• Est. Priority Date: 12/25/2015
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Nishimura, Isamu, Fuwa, Yasuhiro
• Primary Examiner(s): FIDLER, SHELBY LEE
• Application Number:
  US15/386,884
• Publication Number:
  US 20170182794A1
• Time in Patent Office: 475 Days
• CPC Class Codes: B41J 2/3351 Electrode layers
• CPC Class Codes: B41J 2/33515 Heater layers
• CPC Class Codes: B41J 2/33525 Passivation layers
• CPC Class Codes: B41J 2/3353 Protective layers
• CPC Class Codes: B41J 2/33535 Substrates
• CPC Class Codes: B41J 2/3354 characterised by geometry
• CPC Class Codes: B41J 2/33545 characterised by dimensions
• CPC Class Codes: B41J 2/3355 characterised by materials
• CPC Class Codes: B41J 2/3357 Surface type resistors
• CPC Class Codes: B41J 2/33595 Conductors through the layered structure
• CPC Class Codes: B41J 2/34 comprising semiconductors

Abstract

A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

Claims

1. A thermal print head comprising:

a semiconductor substrate;

a resistor layer formed on the semiconductor substrate and having a plurality of heat generating portions arranged in a main scanning direction;

a wiring layer formed on the semiconductor substrate and included in a conduction path for energizing the plurality of heat generating portions;

an insulating protective layer covering the wiring layer and the resistor layer; and

an insulation layer formed on the semiconductor substrate,

wherein the conduction path includes the semiconductor substrate,

the wiring layer includes a plurality of individual electrodes and a common electrode, the plurality of individual electrodes being connected to the plurality of heat generating portions, respectively, the common electrode includes a portion arranged opposite to the plurality of individual electrodes with respect to the plurality of heat generating portions, the common electrode being electrically connected to the plurality of heat generating portions, and the common electrode being electrically connected to the semiconductor substrate,

the insulation layer is formed with a common-electrode first opening for electrically connecting the semiconductor substrate to the common electrode, and formed with a common-electrode second opening opposite to the common-electrode first opening with respect to the plurality of heat generating portions in a sub-scanning direction for electrically connecting the semiconductor substrate to the common electrode,

the resistor layer includes a resistor-side second through-conductive portion held in contact with the semiconductor substrate via the common-electrode second opening.

2. The thermal print head according to claim 1, wherein the common-electrode first opening is elongated in the main scanning direction.

3. The thermal print head according to claim 1, wherein the resistor layer includes a resistor-side first through-conductive portion held in contact with the semiconductor substrate via the common-electrode first opening.

4. The thermal print head according to claim 3, wherein the common electrode includes a wiring-side first through-conductive portion held in contact with the resistor-side first through-conductive portion.

5. The thermal print head according to claim 1, wherein the semiconductor substrate is made of Si doped with a metallic element.

6. The thermal print head according to claim 1, wherein the resistor layer is made of TaN.

7. The thermal print head according to claim 1, wherein the wiring layer is made of Cu.

8. The thermal print head according to claim 1, wherein the common electrode includes a wiring-side second through-conductive portion held in contact with the resistor-side second through-conductive portion.

9. The thermal print head according to 8, further comprising a plurality of control elements that are electrically connected to the wiring layer for individually energizing the plurality of heat generating portions.

10. The thermal print head according to claim 9, wherein the common-electrode second opening overlaps with the control elements as viewed in the thickness direction.

11. The thermal print head according to claim 9, wherein the insulating protective layer is formed with control element openings that partially expose the plurality of individual electrodes or the common electrode.

12. The thermal print head according to claim 11, further comprising control element pads formed in the control element openings.

13. The thermal print head according to claim 12, wherein the control elements are conductively bonded to the control element pads.

14. The thermal print head according to claim 9, wherein the insulating protective layer is formed with a wiring member opening opposite to the plurality of heat generating portions with respect to the control elements in the sub-scanning direction for exposing the wiring layer.

15. The thermal print head according to claim 14, further comprising a wiring member pad formed in the wiring member opening.

16. The thermal print head according to claim 15, further comprising a wiring member bonded to the wiring member pad.

17. The thermal print head according to claim 16, wherein the wiring member comprises a flexible wiring board.

18. The thermal print head according to claim 9, wherein the semiconductor substrate includes:

an obverse surface and a reverse surface that face away from each other in a thickness direction; and

a projection projecting from the obverse surface in the thickness direction and elongated in the main scanning direction, and the heat generating portions overlap with the projection as viewed in the thickness direction.

19. The thermal print head according to claim 18, wherein the obverse surface includes a first region and a second region spaced apart from each other in the sub-scanning direction with the projection intervening therebetween.

20. The thermal print head according to claim 19, wherein the projection includes:

a top surface parallel to the obverse surface and spaced apart from the obverse surface in the thickness direction;

a first inclined side surface located between the top surface and the first region and inclined relative to the obverse surface; and

a second inclined side surface located between the top surface and the second region and inclined relative to the obverse surface.

21. The thermal print head according to claim 20, wherein the heat generating portions overlap with the top surface as viewed in the thickness direction.

22. The thermal print head according to claim 21, wherein the common-electrode first opening overlaps with the first region as viewed in the thickness direction.

23. The thermal print head according to claim 22, wherein the common-electrode second opening overlaps with the second region as viewed in the thickness direction.

24. The thermal print head according to claim 23, wherein the control elements overlap with the second region as viewed in the thickness direction.

25. The thermal print head according to claim 20, further comprising a conductive protective layer that overlaps with the plurality of heat generating portions as viewed in the thickness direction and is formed on the insulating protective layer.

26. The thermal print head according to claim 25, wherein the conductive protective layer is made of TiN.

27. The thermal print head according to claim 26, wherein the insulating protective layer is formed with a conductive-protective-layer opening for electrically connecting the conductive protective layer to the common electrode.

28. The thermal print head according to claim 27, wherein the conductive protective layer includes a protective layer through-conductive portion held in contact with the common electrode via the conductive-protective-layer opening.

29. The thermal print head according to claim 28, wherein the conductive-protective-layer opening overlaps with the first region as viewed in the thickness direction.

30. The thermal print head according to claim 20, wherein the semiconductor substrate includes a heat-conduction-preventing first recess that is recessed from the obverse surface toward the reverse surface.

31. The thermal print head according to claim 30, wherein the heat-conduction-preventing first recess is elongated in the main scanning direction.

32. The thermal print head according to claim 30, wherein the heat-conduction-preventing first recess is at the second region.

33. The thermal print head according to claim 30, wherein the insulating layer includes a first recess-filling portion that fills the heat-conduction-preventing first recess.

34. The thermal print head according to claim 30, wherein the semiconductor substrate includes a heat-conduction-preventing second recess that is recessed from the top surface.

35. The thermal print head according to claim 34, wherein the insulating layer includes a second recess-filling portion that fills the heat-conduction-preventing second recess.