Electronic device with heat spreading film

• US 9,939,672 B2
• Filed: 09/26/2014
• Issued: 04/10/2018
• Est. Priority Date: 06/13/2014
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Kakuda, Tyler R., Gettemy, Shawn R., Sullivan, Mark T., Chowdhury, Ihtesham H.
• Primary Examiner(s): Merlin, Jessica M
• Assistant Examiner(s): TEETS, MARK D
• Application Number:
  US14/498,814
• Publication Number:
  US 20150362791A1
• Time in Patent Office: 1,292 Days
• CPC Class Codes: F28F 2013/006 Heat conductive materials
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/133317 Intermediate frames, e.g. between backlight housing and front frame
• CPC Class Codes: G02F 1/133385 with cooling means, e.g. fans
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: H01L 2023/4068 Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/40 Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs

Abstract

An electronic device may have a housing in which components are mounted that produce heat. The heat producing components may be light-emitting diodes mounted on a flexible printed circuit in a display backlight, may be integrated circuits, or may be other devices that generate heat during operation. A heat spreading layer such as a layer of graphite may be attached to the backlight unit or other structures in the electronic device using adhesive. The adhesive may be patterned to form an unbonded area between at least some of the backlight unit or other structures to which the heat spreading layer is being attached and the heat spreading layer. The heat spreading layer may be mounted adjacent to a housing structure such as a metal midplate member that is attached to housing walls in the housing.

Claims

1. A display, comprising:

display layers including a layer of liquid crystal material;

backlight structures that supply backlight that passes through the display layers; and

a heat spreading layer that is attached to the backlight structures, wherein the heat spreading layer includes patterned adhesive that attaches first portions of the heat spreading layer to the backlight structures and that does not attach second portions of the heat spreading layer to the backlight structures, wherein the heat spreading layer is positioned in a first position at a first temperature and a second position at a second temperature, wherein in the first position the first and second portions of the heat spreading layer are separated from a metal midplate by an air gap, wherein in the second position the first portions of the heat spreading layer are separated from the metal midplate by the air gap and the second portions of the heat spreading layer directly contact the metal midplate, and wherein the second temperature is greater than the first temperature.

2. The display defined in claim 1 wherein the heat spreading layer comprises a layer of graphite.

3. The display defined in claim 1 wherein the heat spreading layer comprises a layer of copper.

4. The display defined in claim 1 wherein the backlight structures include a light guide plate and a reflector and wherein the patterned adhesive attaches the heat spreading layer to the backlight structures so that the reflector is interposed between the heat spreading layer and the light guide plate.

5. The display defined in claim 4 further comprising:

light-emitting diodes that supply light to the light guide plate; and

a flexible printed circuit on which the light-emitting diodes are mounted.

6. The display defined in claim 5 further comprising light blocking tape that is attached to the flexible printed circuit and the reflector.

7. The display defined in claim 6 wherein the light blocking tape is interposed between the heat spreading structures and the flexible printed circuit.

8. The display defined in claim 7 wherein the patterned adhesive includes patterned adhesive selected from the group consisting of:

a C-shape strip of adhesive, an array of adhesive patches, a cross-shaped region of adhesive, and parallel strips of adhesive.

9. An electronic device, comprising:

a housing that includes a metal midplate member;

display layers including a layer of liquid crystal material;

backlight structures that supply backlight that passes through the display layers; and

a flexible heat spreading layer that is attached to the backlight structures, wherein at first temperature the entire flexible heat spreading layer is separated from the metal midplate member by an air gap, wherein at a second temperature at least a portion of the flexible heat spreading layer expands across the air gap to contact the metal midplate member, wherein the second temperature is greater than the first temperature, and wherein the flexible heat spreading layer is heated from the first temperature to the second temperature by heat generated by the backlight structures.

10. The electronic device defined in claim 9 wherein the heat spreading layer comprises:

at least one polymer layer;

a layer of graphite on the polymer layer;

adhesive that attaches the heat spreading layer to the backlight structures.

11. The electronic device defined in claim 10 wherein the backlight structures comprise:

light-emitting diodes on a flexible printed circuit; and

a reflector.

12. The electronic device defined in claim 11 wherein the adhesive forms a strip that runs along at least one edge of the backlight structures and creates an unbonded area between the heat spreading layer and the backlight structures.

13. The electronic device defined in claim 12 wherein the backlight structures comprise a chassis, wherein the backlight structures include a light guide plate that receives light from the light-emitting diodes, wherein the light guide plate and the reflector are mounted in the chassis, and wherein at least some of the adhesive is attached to the chassis.

14. An apparatus, comprising:

a flexible structure that is supplied with heat in an electronic device, wherein the flexible structure is a flexible structure selected from the group consisting of;

an organic light-emitting diode display and a flexible printed circuit in a backlight unit; and

a flexible heat spreading layer having adhesive that is patterned to attach the flexible heat spreading layer to the flexible structure so that there is at least one unbonded region of the flexible heat spreading layer that is free of adhesive, wherein the unbonded region is interposed between first and second regions of the flexible heat spreading layer that are attached to the flexible structure with the adhesive, wherein at a first temperature the entire flexible heat spreading layer is separated from a metal structure by and air gap, wherein at a second temperature at least a portion of the unbonded region of the flexible heat spreading layer extends across the air gap to directly contact the metal structure, and wherein the second temperature is greater than the first temperature.

15. The apparatus defined in claim 14 wherein the flexible structure comprises the organic light-emitting diode display.

16. The apparatus defined in claim 15 wherein the flexible heat spreading layer includes a layer of graphite.

17. The apparatus defined in claim 14 wherein the flexible structure comprises the flexible printed circuit in the backlight unit, wherein the backlight unit includes light-emitting diodes on the flexible printed circuit, a light guide plate, and a reflector, and wherein the apparatus further comprises light-blocking tape attached to the flexible printed circuit and the reflector.

18. The apparatus defined in claim 14 wherein the metal structure is a stainless steel plate.

19. The apparatus defined in claim 14, wherein the flexible heat spreading layer is parallel to the metal structure at the first temperature.

20. The apparatus defined in claim 14, wherein the heat spreading layer has at least one bend at the second temperature.