Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
First Claim
1. A method for substrate modification comprising:
- providing a substrate of a first material, the substrate having a first surface;
providing a first nozzle and a second nozzle, the first nozzle dispensing a first solvent paste including electrically conductive nanoparticles of a second material, and the second nozzle dispensing a second solvent paste including electrically non-conductive nanoparticles of a third material;
moving the nozzles across the first surface for additively depositing a layer comprising sequential and contiguous zones alternatingly composed of the first solvent paste and the second solvent paste, the layer having uniform thickness;
applying energy to increase the temperature for sintering together the nanoparticles of the second material and the nanoparticles of the third material, and for concurrently diffusing second material and third material into the substrate adjoining the first surface;
wherein the sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.
1 Assignment
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Accused Products
Abstract
In an embodiment, a substrate made of a first material and having a surface is provided. A first and second nozzle dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles respectively while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer comprising sequential and contiguous zones alternating between the first solvent paste and the second solvent paste. Energy is applied to the nanoparticles to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.
66 Citations
14 Claims
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1. A method for substrate modification comprising:
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providing a substrate of a first material, the substrate having a first surface; providing a first nozzle and a second nozzle, the first nozzle dispensing a first solvent paste including electrically conductive nanoparticles of a second material, and the second nozzle dispensing a second solvent paste including electrically non-conductive nanoparticles of a third material; moving the nozzles across the first surface for additively depositing a layer comprising sequential and contiguous zones alternatingly composed of the first solvent paste and the second solvent paste, the layer having uniform thickness; applying energy to increase the temperature for sintering together the nanoparticles of the second material and the nanoparticles of the third material, and for concurrently diffusing second material and third material into the substrate adjoining the first surface; wherein the sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for enhancing adhesion of packaged semiconductor devices, comprising:
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providing a substrate of a first material, the substrate having a first surface; providing a first nozzle and a second nozzle, the first nozzle dispensing a first solvent paste including electrically conductive nanoparticles of a second material, and the second nozzle dispensing a second solvent paste including electrically non-conductive nanoparticles of a third material; moving the nozzles across the first surface for additively depositing a layer comprising sequential and contiguous zones alternatingly composed of the first solvent paste and the second solvent paste, the layer having uniform thickness; applying energy to increase the temperature for sintering together the nanoparticles of the second material and the nanoparticles of the third material, and for concurrently diffusing second material and third material into the substrate region adjoining the first surface; wherein the sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones; and encapsulating the sintered nanoparticle layer and at least portions of the substrate into a package of a fourth material, the fourth material adhering to at least portions of the sintered nanoparticle layer. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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Specification