Power module
First Claim
1. A power module, comprising:
- a substrate comprising a first conductive layer disposed on a first surface and a second conductive layer disposed on a second surface opposite to the first surface, the first conductive layer comprising a plurality of conductive blocks, wherein the plurality of conductive blocks further comprises a first conductive block, a second conductive block, a third conductive block and a fourth conductive block;
a first sub-module disposed on the first conductive layer, the first sub-module comprising a first semiconductor switch and a first diode which is connected in parallel with the first semiconductor switch, wherein the first sub-module further comprises a first electrode, a second electrode, a third electrode and a fourth electrode, and the third electrode is electrically connected with the third conductive block;
a second sub-module disposed on the first conductive layer, the second sub-module comprising a second semiconductor switch and a second diode which is connected in parallel with the second semiconductor switch, the second semiconductor switch being electrically connected with the first semiconductor switch through the plurality of conductive blocks, wherein the second sub-module further comprises a fifth electrode, a sixth electrode and a seventh electrode, and the seventh electrode is electrically contacted with the third conductive block;
a conductive pin disposed on the first conductive layer and electrically connected with at least one of the conductive blocks, wherein a first end of the conductive pin is electrically connected with the first conductive block;
a circuit board disposed on the conductive pin and electrically connected with the first semiconductor switch and the second semiconductor switch through the conductive pin; and
a heat sink disposed on the second conductive layer;
wherein the first sub-module further comprises a first thermal/electrical conduction structure and a first lead electrode, and the second sub-module further comprises a second thermal/electrical conduction structure and a second lead electrode, wherein the first thermal/electrical conduction structure is arranged between the first electrode and the first lead electrode and electrically connected with the first electrode and the first lead electrode, wherein the second thermal/electrical conduction structure is arranged between the sixth electrode and the second lead electrode, and electrically connected with the sixth electrode and the second lead electrode, wherein the first lead electrode is electrically connected with the first conductive block.
1 Assignment
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Accused Products
Abstract
A power module includes a substrate, a first sub-module, a second sub-module and a circuit board. The semiconductor switches and the diodes of the first sub-module and the second sub-module are embedded within insulation layers. Consequently, the first sub-module and the second sub-module are formed as a high-voltage-side switching element and a low-voltage-side switching element of a bridge circuit. The first sub-module and the second sub-module are disposed on a first surface of the substrate. An electrode of the first sub-module and some electrodes of the second sub-module are electrically connected with corresponding conducting parts of a circuit board. A heat sink is disposed on a second surface of the substrate.
5 Citations
18 Claims
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1. A power module, comprising:
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a substrate comprising a first conductive layer disposed on a first surface and a second conductive layer disposed on a second surface opposite to the first surface, the first conductive layer comprising a plurality of conductive blocks, wherein the plurality of conductive blocks further comprises a first conductive block, a second conductive block, a third conductive block and a fourth conductive block; a first sub-module disposed on the first conductive layer, the first sub-module comprising a first semiconductor switch and a first diode which is connected in parallel with the first semiconductor switch, wherein the first sub-module further comprises a first electrode, a second electrode, a third electrode and a fourth electrode, and the third electrode is electrically connected with the third conductive block; a second sub-module disposed on the first conductive layer, the second sub-module comprising a second semiconductor switch and a second diode which is connected in parallel with the second semiconductor switch, the second semiconductor switch being electrically connected with the first semiconductor switch through the plurality of conductive blocks, wherein the second sub-module further comprises a fifth electrode, a sixth electrode and a seventh electrode, and the seventh electrode is electrically contacted with the third conductive block; a conductive pin disposed on the first conductive layer and electrically connected with at least one of the conductive blocks, wherein a first end of the conductive pin is electrically connected with the first conductive block; a circuit board disposed on the conductive pin and electrically connected with the first semiconductor switch and the second semiconductor switch through the conductive pin; and a heat sink disposed on the second conductive layer; wherein the first sub-module further comprises a first thermal/electrical conduction structure and a first lead electrode, and the second sub-module further comprises a second thermal/electrical conduction structure and a second lead electrode, wherein the first thermal/electrical conduction structure is arranged between the first electrode and the first lead electrode and electrically connected with the first electrode and the first lead electrode, wherein the second thermal/electrical conduction structure is arranged between the sixth electrode and the second lead electrode, and electrically connected with the sixth electrode and the second lead electrode, wherein the first lead electrode is electrically connected with the first conductive block. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification