Polyimide-containing layer and method for etching polyimide-containing layer

• US 9,982,108 B2
• Filed: 05/22/2013
• Issued: 05/29/2018
• Est. Priority Date: 07/18/2012
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Lin, Chih-Cheng, Leu, Chyi-Ming
• Primary Examiner(s): Shosho, Callie
• Assistant Examiner(s): FREEMAN, JOHN D
• Application Number:
  US13/900,324
• Publication Number:
  US 20140021169A1
• Time in Patent Office: 1,833 Days
• CPC Class Codes: C08J 2379/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08J 7/12 Chemical modification
• CPC Class Codes: C08K 2003/2227 of aluminium
• CPC Class Codes: C08K 3/20 Oxides; Hydroxides graphene oxides C08K3/042
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2203/0769 Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
• CPC Class Codes: H05K 2203/0793 Aqueous alkaline solution, e.g. for cleaning or etching
• CPC Class Codes: Y10T 428/259 Silicic material
• CPC Class Codes: Y10T 428/31721 Of polyimide

Abstract

The disclosure provides a polyimide-containing layer suitable for being etched by an alkaline solution and a method for etching a polyimide-containing layer. The polyimide-containing layer suitable for being etched by an alkaline solution includes 20-50 parts by weight of a silica dioxide, and 50-80 parts by weight of a polyimide.

Claims

1. A method for etching a polyimide-containing layer, comprising:

providing a polyimide-containing composition, wherein the polyimide-containing composition consists of;

a solvent selected from the group consisting of a cycloketone solvent, an amide solvent, a phenol solvent, and combinations thereof;

20-50 parts by weight of an inorganic silicon oxide having a particle size of 10-100 nm; and

50-80 parts by weight of a polyimide, wherein the inorganic silicon oxide and the polyimide are dispersed in the solvent;

coating the polyimide-containing composition on a substrate;

drying the polyimide-containing composition to form a polyimide-containing layer on the substrate; and

etching the polyimide-containing layer with an alkaline solution to completely remove the polyimide-containing layer, wherein the alkaline solution comprises water, an alkanolamine, and an alkali metal hydroxide.

2. The method as claimed in claim 1, wherein the polyimide-containing composition has a solid content of 10-40 wt %.

3. The method as claimed in claim 1, wherein the polyimide-containing composition has a viscosity of more than 1000 cps.

4. The method as claimed in claim 1, wherein the weight ratio between the alkanolamine and the alkali metal hydroxide is from 1:

4 to 4;

1.

5. The method as claimed in claim 1, wherein the weight percentage of the alkanolamine and alkali metal hydroxide is 20-30 wt %, based on the weight of the alkaline solution.