Substrate with array of LEDs for backlighting a display device

• US 9,985,003 B2
• Filed: 11/07/2016
• Issued: 05/29/2018
• Est. Priority Date: 03/20/2015
• Status: Active Grant

• Current Assignee: Rohinni LLC
• Original Assignee: Rohinni LLC
• Inventors: Huska, Andrew, Kupcow, Sean, Peterson, Cody, Adams, Clinton
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US15/345,425
• Publication Number:
  US 20170053901A1
• Time in Patent Office: 568 Days
• Field of Search: 174260, 174250, 313511, 315185 R, 600301, 600345, 600372, 600373, 600476, 604 20, 604264, 606 21, 606 33, 606 41
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133605 including specially adapted reflectors
• CPC Class Codes: G02F 1/133606 including a specially adapted diffusing, scattering or light controlling members
• CPC Class Codes: G02F 1/133612 Electrical details
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67265 of substrates stored in a container, a magazine, a carrier, a boat or the like
• CPC Class Codes: H01L 21/67715 Changing the direction of the conveying path
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 : Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2223/54413 : comprising digital information, e.g. bar codes, data matrix
• CPC Class Codes: H01L 2223/54426 : for alignment
• CPC Class Codes: H01L 2223/54433 : containing identification or tracking information
• CPC Class Codes: H01L 2223/54486 : Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/16238 : the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/75252 : in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75261 : Laser
• CPC Class Codes: H01L 2224/75262 : in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75303 : of the pressing surface
• CPC Class Codes: H01L 2224/7531 : of other parts
• CPC Class Codes: H01L 2224/75314 : Auxiliary members on the pressing surface
• CPC Class Codes: H01L 2224/75317 : Removable auxiliary member
• CPC Class Codes: H01L 2224/75651 : Belt conveyor
• CPC Class Codes: H01L 2224/75753 : Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/75824 : Translational mechanism
• CPC Class Codes: H01L 2224/75842 : Rotational mechanism
• CPC Class Codes: H01L 2224/75843 : Pivoting mechanism
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/83224 : using a laser
• CPC Class Codes: H01L 23/53242 : the principal metal being a noble metal, e.g. gold
• CPC Class Codes: H01L 23/544 : Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/89 : using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/405 : Wavelength
• CPC Class Codes: H01L 2933/0066 : relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of LEDs are connected to the substrate via the circuit trace. The predetermined pattern is arranged as an array of lines along a surface of the substrate, and the plurality of LEDs are distributed along the lines of the array.

Claims

1. A circuit component for a display, comprising:

a flexible substrate;

a circuit trace having a predetermined pattern disposed on a surface of the substrate;

a plurality of semiconductor die connected to the substrate via the circuit trace, the plurality of semiconductor die being distributed across the surface of the substrate; and

one or more substrate orientation datum points disposed on the substrate,

wherein the circuit component is formed by a method including;

positioning the surface of the substrate to face a first surface of a wafer tape having at least one semiconductor die of the plurality of semiconductor die thereon,

using the one or more substrate orientation datum points to orient at least one of the surface of the substrate or the wafer tape such that the circuit trace is aligned for a transfer of the at least one semiconductor die to the circuit trace,

causing a needle to thrust against a second surface of the wafer tape at a position corresponding to a location of the at least one semiconductor die on the first surface of the wafer tape, the second surface of the wafer tape being opposite the first surface of the wafer tape, and

attaching the at least one semiconductor die to the substrate, and

wherein the substrate orientation datum points are readable via a sensor of an apparatus that performs the method, the substrate orientation datum points providing information regarding a position of the circuit trace on the substrate, thereby indicating a transfer location for the at least one semiconductor die.

2. The circuit component according to claim 1, wherein the attaching the at least one semiconductor die includes emitting energy to the circuit trace via the substrate at a position of the substrate whereon the at least one semiconductor die is being attached.

3. The circuit component according to claim 2, wherein the emitting energy included activating a laser to heat the circuit trace to a softening point.

4. The circuit component according to claim 1, wherein positioning the surface of the substrate includes:

securing the substrate in a first frame,

securing the wafer tape in a second frame, and

aligning the substrate with the wafer tape to a transfer position.

5. The circuit component according to claim 1, wherein the circuit trace is a conductive ink and a thickness of the circuit trace ranges from about 5 microns to about 20 microns.

6. The circuit component according to claim 1, wherein the predetermined pattern includes an array of lines along the surface of the substrate.

7. The circuit component according to claim 1, wherein a material of the substrate includes a polymer.

8. The circuit component according to claim 7, wherein the polymer includes one of a polyester, an acrylic, a polyimide, or a polycarbonate.

9. The circuit component according to claim 1, wherein a height of the plurality of semiconductor die ranges from about 12.5 microns to about 200 microns.

10. The circuit component according to claim 1, wherein the plurality of semiconductor die are electrically interconnected via the circuit trace.

11. The circuit component according to claim 1, wherein the circuit trace includes a silver-coated copper particle.

12. The circuit component according to claim 1, wherein the circuit trace is pre-formed in the array prior to the plurality of semiconductor die being connected to the surface of the substrate.

13. The circuit component according to claim 9, wherein a height of the plurality of semiconductor die ranges from about 25 microns to no greater than 100 microns.

14. The circuit component according to claim 1, wherein the plurality of semiconductor die includes LEDs.