Display backplane, manufacturing method thereof and display device
First Claim
1. A display backplane, comprising:
- a substrate;
an array of organic light emitting elements and an array of transistors for driving and controlling the array of organic light emitting elements formed on the substrate; and
a heat insulation layer formed between the array of organic light emitting elements and the array of transistors, whereinthe heat insulation layer is provided with a heat insulation layer via hole, through which the array of transistors is connected with the array of organic light emitting elements, andthe display backplane further comprises;
a heat conduction layer formed on a side of the array of the organic light emitting elements away from the array of the transistors;
an encapsulation layer for encapsulating the substrate on which the array of organic light emitting elements and the array of transistors are formed, wherein the heat conduction layer is formed between the array of organic light emitting elements and the encapsulation layer;
a cover plate and a heat dissipation layer arranged on a side of the encapsulation layer away from the array of organic light emitting elements, wherein the cover plate is arranged between the heat dissipation layer and the encapsulation layer,wherein the heat dissipation layer comprises a heat dissipation sheet and a heat dissipation pin, the heat dissipation pin being formed on a side of the heat dissipation sheet away from the cover plate.
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Abstract
The present invention provides a display backplane and a manufacturing method thereof, as well as a display device. The display backplane comprising: a substrate; an array of organic light emitting elements and an array of transistors for driving and controlling the array of organic light emitting elements formed on the substrate; and a heat insulation layer formed between the array of organic light emitting elements and the array of transistors, wherein the heat insulation layer is provided with a heat insulation layer via hole, through which the array of transistors is connected with the array of organic light emitting elements. The display backplane provided in the present invention can reduce the conduction of heat generated by the array of organic light emitting elements during lighting to the array of transistors, thus avoiding problems caused thereby such as uneven display.
8 Citations
12 Claims
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1. A display backplane, comprising:
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a substrate; an array of organic light emitting elements and an array of transistors for driving and controlling the array of organic light emitting elements formed on the substrate; and a heat insulation layer formed between the array of organic light emitting elements and the array of transistors, wherein the heat insulation layer is provided with a heat insulation layer via hole, through which the array of transistors is connected with the array of organic light emitting elements, and the display backplane further comprises;
a heat conduction layer formed on a side of the array of the organic light emitting elements away from the array of the transistors;an encapsulation layer for encapsulating the substrate on which the array of organic light emitting elements and the array of transistors are formed, wherein the heat conduction layer is formed between the array of organic light emitting elements and the encapsulation layer; a cover plate and a heat dissipation layer arranged on a side of the encapsulation layer away from the array of organic light emitting elements, wherein the cover plate is arranged between the heat dissipation layer and the encapsulation layer, wherein the heat dissipation layer comprises a heat dissipation sheet and a heat dissipation pin, the heat dissipation pin being formed on a side of the heat dissipation sheet away from the cover plate. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for manufacturing a display backplane, comprising:
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forming on a substrate an array of organic light emitting elements and an array of transistors for driving and controlling the array of organic light emitting elements; and forming a heat insulation layer between the array of organic light emitting elements and the array of transistors, wherein the heat insulation layer is provided with a heat insulation layer via hole formed therein, and wherein the array of transistors is connected with the array of organic light emitting elements through the insulation layer via hole, and the method further comprises;
forming a heat conduction layer on a side of the array of organic light emitting elements away from the array of transistors;forming a passivation layer between the array of organic light emitting elements and the array of transistors, wherein the heat insulation layer is positioned between the passivation layer and the bottom electrode of the organic light emitting element in the array of organic light emitting elements; and the passivation layer is provided with a passivation layer via hole formed therein, the position of which corresponds to that of the heat insulation layer via hole, and the drain of the transistor in the array of transistors is connected with the bottom electrode of the organic light emitting element in the array of organic light emitting elements via the passivation layer via hole and the heat insulation layer via hole, wherein the step of forming the heat insulation layer comprises; coating a mixed material of a heat insulation material and a photoresist onto the passivation layer; and exposing and developing the mixed material coated onto the passivation layer using a photolithography process, to form a heat insulation layer provided with a heat insulation layer via hole. - View Dependent Claims (8, 9)
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10. A display device, comprising a display backplane, the display backplane comprising:
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a substrate; an array of organic light emitting elements and an array of transistors for driving and controlling the array of organic light emitting elements formed on the substrate; and a heat insulation layer formed between the array of organic light emitting elements and the array of transistors, wherein the heat insulation layer is provided with a heat insulation layer via hole, through which the array of transistors is connected with the array of organic light emitting elements, and the display backplane further comprises;
a heat conduction layer formed on a side of the array of the organic light emitting elements away from the array of the transistors;an encapsulation layer for encapsulating the substrate on which the array of organic light emitting elements and the array of transistors are formed, wherein the heat conduction layer is formed between the array of organic light emitting elements and the encapsulation layer; a cover plate and a heat dissipation layer arranged on a side of the encapsulation layer away from the array of organic light emitting elements, wherein the cover plate is arranged between the heat dissipation layer and the encapsulation layer, wherein the heat dissipation layer comprises a heat dissipation sheet and a heat dissipation pin, the heat dissipation pin being formed on a side of the heat dissipation sheet away from the cover plate. - View Dependent Claims (11, 12)
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Specification