Sensor module

• US D775,542 S1
• Filed: 05/26/2015
• Issued: 01/03/2017
• Est. Priority Date: 05/22/2014
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Phillips, Sheldon George, Nuovo, Frank, Kopp, Joseph J Jr., Torfs, Tom, Brown, Lindsay, Lee, Seulki, Wentink, Eva C.
• Primary Examiner(s): Davis, Antoine D
• Application Number:
  US29/528,113
• Time in Patent Office: 588 Days
• Field of Search: D10 30- 39, D10/65, D10/70, D10/78, D10/97, D10/98, D10/103, D11/3, D13173-177, D14/138.R, D14/203.5, D14/247, D14338-340, D14/344, D14/346, D14/347, D24/167, D24/168
• US Class Current: D10/103
• CPC Class Codes: N/A

Claims

1. The ornamental design for a sensor module, as shown and described.