Reconfigurable processor module comprising hybrid stacked integrated circuit die elements

  • US RE42,035 E1
  • Filed: 07/23/2008
  • Issued: 01/18/2011
  • Est. Priority Date: 12/05/2001
  • Status: Active Grant
First Claim
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1. A processor module comprising:

  • at least a first integrated circuit die element including a programmable array;

    at least a second integrated circuit die element stacked with and electrically coupled to said programmable array of said first integrated circuit die element; and

    wherein said first and second integrated circuit die elements are electrically coupled by a number of contact points distributed throughout the surfaces of said die elements, and wherein said contact points traverse said die elements through a thickness thereof.

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