Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board

• US RE42,542 E1
• Filed: 09/06/2007
• Issued: 07/12/2011
• Est. Priority Date: 05/10/2002
• Status: Active Grant

• Current Assignee: Transpacific Infinity LLC
• Original Assignee: Transpacific Infinity LLC
• Inventors: Palanisamy, Ponnusamy
• Primary Examiner(s): Zarneke; David A
• Assistant Examiner(s): Wagner; Jenny L
• Application Number:
  US11/900,009
• Time in Patent Office: 1,405 Days
• Field of Search: 438/108, 438/106, 438/107, 438/110, 438/112, 438/121, 438/122, 438/113, 438/611, 438/612, 438/613, 174/254, 174/260, 361/749
• US Class Current: 438/106
• CPC Class Codes: G02F 1/133382 Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2251/5338 Flexible OLED
• CPC Class Codes: H01L 27/3288 Wiring lines
• CPC Class Codes: H01L 27/3293 Tiled displays
• CPC Class Codes: H01L 51/524 Sealing arrangements having a self-supporting structure, e.g. containers
• CPC Class Codes: H01L 51/529 Arrangements for heating or cooling
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/363 by soldering
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49151 by deforming or shaping
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.

Claims

1. A method of manufacturing an electronic device, which includes a substrate having a non-planar back surface and a first thermal expansion coefficient, a plurality of electronic components coupled to the substrate, and a plurality of device electrical contacts coupled to the non-planar back surface of the substrate and electrically coupled to the plurality of electronic components, and a coupled flexible circuit board, which includes a flexible substrate having a front surface and a back surface, and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate corresponding to plurality of device electrical contacts, comprising the steps of:

a) providing the electronic device;

b) providing the flexible circuit board;

c) forming a plurality of conductive bumps on at least one of the electronic device and the flexible circuit board, for each device electrical contact, a conductive bump formed on at least one of that device electrical contact and a corresponding circuit board electrical contact;

d) aligning the plurality of device electrical contacts of the electronic device and the corresponding plurality of circuit board electrical contacts;

e) pressing the electronic device and the flexible circuit board together such that at least one of the plurality of conductive bumps spans the gap between each device electrical contact and the corresponding circuit board electrical contact; and

f) curing the plurality of conductive bumps to form a plurality of Z-interconnections electrically and mechanically coupling the plurality of device electrical contacts to the corresponding plurality of circuit board electrical contacts, wherein the at least one of the front or back surfaces of the flexible substrate is non-planar.

2. The method of claim 1, wherein the plurality of conductive bumps are formed of at least orie of indium, a conductive solder, a conductive thermally-curable epoxy, a conductive radiation-curable epoxy, a conductive thermoplastic, and a conductive elastomer.

3. The method of claim 1, wherein:

the plurality of conductive bumps are indium bumps; and

step (f) includes the step of pressing the electronic device and the flexible circuit board together to deform the indium bumps and cold weld the plurality of device electrical contacts to the corresponding plurality of circuit board electrical contacts.

4. The method of claim 1, wherein:

the plurality of conductive bumps are conductive solder bumps; and

step (f) includes the steps of;

f1) beating the conductive solder bumps to at least a melting point temperature; and

f2) forming the plurality of Z-interconnections by solder reflow.

5. The method of claim 1, wherein:

the plurality of conductive humps include a plurality of conductive thermally-curable epoxy bumps having a first curing temperature; and

step (f) includes the steps of;

f1) pressing the electronic device and the flexible circuit board together to deform the plurality of conductive thermally-curable epoxy bumps; and

f2) heating the plurality of deformed conductive thermally-curable epoxy bumps to at least the first curing temperature.

6. The method of claim 5, wherein:

step (c) further includes the step of forming a non-conductive thermally-curable epoxy fill layer on at least one of a portion of the non-planar back surface of the electronic device and a portion of the front surface of the flexible circuit board, the non-conductive thermally-curable epoxy fill layer having a second curing temperature approximately equal to the first curing temperature of the conductive thermally-curable epoxy bumps; and

step (f2) further includes heating the non-conductive thermally-curable epoxy fill layer to at least the second curing temperature.

7. The method of claim 1, wherein:

the plurality of conductive humps include a plurality of conductive radiation-curable epoxy bumps; and

step (f) includes the steps of;

f1) pressing the electronic device and the flexible circuit board together to deform the plurality of conductive radiation-curable epoxy bumps; and

f2) irradiating the plurality of deformed conductive radiation-curable epoxy bumps.

8. The method of claim 7, wherein:

step (c) further includes the step of forming a non-conductive radiation-curable epoxy fill layer on at least one of a portion of the non-planar back surface of the electronic device and a portion of the front surface of the flexible circuit board; and

step (f2) further includes irradiating the non-conductive radiation-curable epoxy fill layer.

9. The method of claim 1, wherein:

the plurality of conductive bumps include a plurality of conductive thermoplastic bumps having a first softening temperature; and

step (f) includes the steps of;

f1) heating the plurality of conductive thermoplastic bumps to at least the first softening temperature;

f2) pressing the electronic device and the flexible circuit board together to deform the plurality of conductive thermoplastic bumps; and

f3) cooling the plurality of deformed conductive thermoplastic bumps to below the first softening temperature.

10. The method of claim 9, wherein:

step (c) further includes the step of forming a non-conductive thermoplastic fill layer on at least one of a portion of the non-planar back surface of the electronic device and a portion of the front surface of the flexible circuit board, the non-conductive thermoplastic fill layer having a second softening temperature approximately equal to the first softening temperature of the conductive thermoplastic bumps;

step (f1) further includes heating the non-conductive thermoplastic fill layer to at least the second softening temperature; and

step (f3) further includes cooling the non-conductive thermoplastic fill layer to below the second softening temperature.

11. The method of claim 1, wherein:

the plurality of conductive bumps include a plurality of conductive elastomer bumps; and

step (f) includes the steps of;

f1) pressing the electronic device and the flexible circuit board together to deform the plurality of conductive elastomer bumps; and

f2) holding the electronic device and the flexible circuit board together until the plurality of deformed conductive elastomer bumps are set.

12. The method of claim 11, wherein:

step (c) further includes the step of forming a non-conductive elastomer fill layer on at least one of a portion of the non-planar back surface of the electronic device and a portion of the front surface of the flexible circuit board; and

step (f2) further includes holding the electronic device and the flexible circuit board together until the non-conductive elastomer fill layer is set.

13. The method of claim 1, wherein at least one of the plurality of conductive bumps has a diameter of less than 5 mils.

14. The method of claim 1, further comprising the step of:

g) laminating a rigid substrate to at least a portion of the back surface of the flexible substrate of the flexible circuit board, the rigid substrate having a second thermal expansion coefficient approximately equal to the first thermal expansion coefficient of the substrate of the electronic device.

15. The method of claim 1, wherein:

the plurality of conductive bumps include a plurality of conductive solder bumps and a plurality of conductive organic bumps, for each device electrical contact;

a conductive solder bump formed on one of that device electrical contact and a corresponding circuit board electrical contact; and

a conductive organic bump formed on a remaining one of that device electrical contact and the corresponding circuit board electrical contact.

16. The method of claim 15, wherein:

the plurality of conductive organic bumps are a plurality of conductive thermally-curable epoxy bumps having a first curing temperature; and

step (f) includes the steps of;

f1) pressing the electronic device and the flexible circuit board together to deform the plurality of conductive thermally-curable epoxy bumps against the plurality of conductive solder bumps; and

f2) heating the plurality of deformed conductive thermally-curable epoxy bumps to at least the first curing temperature.

17. The method of claim 15, wherein:

the plurality of conductive organic bumps are a plurality of conductive radiation-curable epoxy bumps; and

step (f) includes the steps of;

f1) pressing the electronic device and the flexible circuit board together to deform the plurality of conductive radiation-curable epoxy bumps against the plurality of conductive solder bumps; and

f2) irradiating the plurality of deformed conductive radiation-curable epoxy bumps.

18. The method of claim 15, wherein:

the plurality of conductive organic bumps are a plurality of conductive thermoplastic bumps having a first softening temperature; and

step (f) includes the steps of;

f1) heating the plurality of conductive thermoplastic bumps to at least the first softening temperature;

f2) pressing the electronic device and the flexible circuit board together to deform the plurality of conductive thermoplastic bumps against the plurality of conductive solder bumps; and

f3) cooling the plurality of deformed conductive thermoplastic bumps to below the first softening temperature.

19. The method of claim 15, wherein:

the plurality of conductive organic bumps are a plurality of conductive elastomer bumps; and

step (f) includes the steps of;

f1) pressing the electronic device and the flexible circuit board together to deform the plurality of conductive elastomer bumps against the plurality of conductive solder bumps; and

f2) holding the electronic device and the flexible circuit board together until the plurality of deformed conductive elastomer bumps are set.

20. A method comprising:

forming an electrical contact on a first surface of a flexible substrate;

forming a device electrical contact on a non-planar surface of a device substrate; and

forming a Z-interconnection, wherein the Z-interconnection electrically and mechanically couples the electrical contact on the flexible substrate to the device electrical contact on the non-planar surface of the device substrate, and wherein the first surface of the flexible substrate is non-planar after said forming a Z-interconnection.

21. The method of claim 20, wherein the Z-interconnection is formed from at least one of indium, a conductive solder, a conductive thermally-curable epoxy, a conductive radiation-curable epoxy, a conductive thermoplastic, or a conductive elastomer.

22. The method of claim 20, wherein said forming a Z-interconnection comprises:

forming a conductive bump on the electrical contact of the flexible substrate or the device electrical contact on the non-planar surface of the device substrate;

aligning the electrical contact with the device electrical contact;

pressing the flexible substrate and the device substrate together; and

curing the conductive bump to form the Z-interconnection.

23. The method of claim 22, wherein the conductive bump is formed by deposition or screen printing.

24. The method of claim 22, wherein said pressing comprises pressing the flexible substrate with a rubber sheet such that an approximately even pressure is applied over the flexible substrate.

25. The method of claim 22, wherein said pressing comprises utilizing an isostatic lamination method.

26. The method of claim 22, wherein the conductive bump is formed from indium, and wherein said curing the conductive bump comprises applying pressure to deform and cold weld the conductive bump into the Z-interconnection.

27. The method of claim 22, wherein the conductive bump is formed from conductive solder, and wherein said curing the conductive bump comprises heating the conductive solder to a melting temperature and forming the Z-interconnection by solder reflow.

28. The method of claim 22, wherein the conductive bump is formed from an epoxy that is conductive and radiation-curable, and wherein said curing the conductive bump comprises irradiating the conductive bump.

29. The method of claim 22, wherein the conductive bump is formed from an epoxy that is conductive and thermally-curable, and wherein said curing the conductive bump comprises heating the conductive bump to a hardening temperature.

30. The method of claim 22, wherein the conductive bump is formed from a conductive elastomer, and wherein said curing the conductive bump comprises holding the conductive bump in place until the conductive elastomer sets.

31. The method of claim 22, wherein the conductive bump is formed from a conductive thermoplastic, and wherein said curing the conductive bump comprises:

heating the conductive bump to a softening temperature;

pressing the flexible substrate and the device substrate together to deform the conductive bump; and

cooling the conductive bump to below the softening temperature to harden the conductive bump.

32. The method of claim 22, wherein the conductive bump is one of a plurality of conductive bumps, and wherein the plurality of conductive bumps comprises a plurality of conductive solder bumps formed on one of the flexible substrate or the device substrate and a plurality of organic conductive bumps formed on the other of the flexible substrate or the device substrate.

33. The method of claim 20, further comprising forming a non-conductive fill layer on at least one of the flexible substrate or the device substrate.

34. The method of claim 33, further comprising:

heating the non-conductive fill layer to a softening temperature; and

cooling the non-conductive fill layer below the softening temperature.

35. The method of claim 33, wherein the non-conductive fill layer comprises a non-conductive organic material.

36. The method of claim 35, wherein the non-conductive organic material comprises thermally-conductive particles.

37. The method of claim 33, wherein the non-conductive fill layer forms a hermetic seal around an electronic component.

38. The method of claim 20, further comprising mounting a heat sink to the flexible substrate.

39. The method of claim 20, further comprising electrically coupling a first electrical trace on the first surface of the flexible substrate to a second electrical trace on a second surface of the flexible substrate using a wirebond or via in the flexible substrate.

40. The method of claim 20, wherein the flexible substrate comprises an elevated portion.

41. The method of claim 40, further comprising mounting an electronic component to the elevated portion of the flexible substrate, wherein the electronic component is isolated from a non-elevated portion of the flexible substrate.

42. The method of claim 20, further comprising folding a portion of the flexible substrate to create a folded elevated portion.

43. The method of claim 20, further comprising laminating a third substrate to at least a portion of the flexible substrate, wherein the third substrate has a first thermal expansion coefficient approximately equal to a second thermal expansion coefficient of the device substrate.

44. A method comprising:

forming a conductive bump on at least one of a flexible substrate or a device substrate;

aligning an electrical contact of the flexible substrate with a corresponding device electrical contact located on a non-planar surface of the device substrate such that the flexible substrate comprises a non-planar surface; and

curing the conductive bump to form a Z-interconnection between the flexible substrate and the device substrate, wherein the Z-interconnection electrically and mechanically couples the electrical contact of the flexible substrate to the corresponding device electrical contact located on the non-planar surface of the device substrate.

45. The method of claim 44, further comprising pressing the flexible substrate and the device substrate together to deform the conductive bump.

46. The method of claim 44, wherein the Z-interconnection is formed from at least one of indium, a conductive solder, a conductive thermally-curable epoxy, a conductive radiation-curable epoxy, a conductive thermoplastic, or a conductive elastomer.

47. The method of claim 44, further comprising forming a non-conductive fill layer on at least one of the flexible substrate or the device substrate.

48. A method comprising:

forming a conductive bump between an electrical contact of a flexible substrate and a corresponding device electrical contact on a non-planar surface of a device substrate; and

curing the conductive bump to form a Z-interconnection between the flexible substrate and the device substrate, wherein the Z-interconnection is configured to electrically and mechanically couple the electrical contact of the flexible substrate to the corresponding device electrical contact on the non-planar surface of the device substrate.

49. The method of claim 48, wherein the Z-interconnection is formed from at least one of indium, a conductive solder, a conductive thermally-curable epoxy, a conductive radiation-curable epoxy, a conductive thermoplastic, or a conductive elastomer.

50. The method of claim 48, further comprising forming a non-conductive fill layer on at least one of the flexible substrate or the device substrate.

51. The method of claim 48, wherein the flexible substrate comprises a non-planar surface after formation of the Z-interconnection.