Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board

Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board

  • CN 100,341,938 C
  • Filed: 07/16/2001
  • Issued: 10/10/2007
  • Est. Priority Date: 07/18/2000
  • Status: Active Grant
First Claim
Patent Images

1. not halogen-containing flame-retardant epoxy resin omposition, it contains the mineral filler of 0~

  • 50 weight %, and contains following component as necessary component;

    (A) at least a crosslinked phenoxyphosphazene compounds of 2-50 weight %,(B) at least a polyepoxides,(C) epoxy with solidifying agent and(D) epoxy curing catalyst;

    Described crosslinked phenoxyphosphazene compounds be at least a phosphazene compound that is selected from the chain phenoxy phosphazene compound shown in ring-type phenoxy phosphazene compound shown in the following structural formula (1) and the following structural formula (2) by be selected from neighbour-phenylene ,-the crosslinked compound of at least a crosslinking group of the represented two phenylenes of phenylene, right-phenylene and following general formula (I)(a) described crosslinking group is inserted between 2 Sauerstoffatoms after phenyl is sloughed in the described phosphazene compound,(b) content ratio of phenyl in the crosslinked compound, with at least a compound that is selected from described ring-type phenoxy phosphazene compound and described chain phenoxy phosphazene compound all phenyl add up to benchmark, be 50~

    99.9%, and(c) intramolecularly does not have free hydroxyl group;

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