Structure of pad in IC and its formation process

Structure of pad in IC and its formation process

CN
  • CN 100,358,137 C
  • Filed: 03/07/2003
  • Issued: 12/26/2007
  • Est. Priority Date: 03/07/2003
  • Status: Active Grant
First Claim
Patent Images

1. the structure of an integrated circuit bonding wire pad is arranged in the insulating barrier, it is characterized in that:

  • the structure of this integrated circuit bonding wire pad comprises;

    One lower conductiving layer is located at appropriate position in this insulating barrier, and is connected to a fixed potential;

    One lamination layer structure, be located on this insulating barrier and and form between this lower conductiving layer and electrically connect, this lamination layer structure is made up of one deck conductive layer at least and one deck conduction articulamentum interaction cascading at least;

    AndOne weld pad conductive layer is located on this lamination layer structure.

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