Chip removal apparatus, fitting system and method of removing chips from a wafer

Chip removal apparatus, fitting system and method of removing chips from a wafer

  • CN 100,386,014 C
  • Filed: 01/02/2003
  • Issued: 04/30/2008
  • Est. Priority Date: 01/30/2002
  • Status: Active Grant
First Claim
Patent Images

1. a chip that takes off chip (100) from structurized semiconductor wafer takes off device, has:

  • -a kind of rotating instrument (110) that takes off, be used for from wafer (400) take off chip (100) and the chip (100) that takes off of upset and-chip (100) that kind of rotating turning tool (130) is used for overturning again on demand and takes off,-wherein, the described instrument (110) that takes off has first and delivers the position and turning tool (130) has second delivers position (140), can on described position, transfer chip to be further processed, wherein be provided with one the 3rd between the instrument and deliver the position to carry out delivering of chip at described turning tool and described taking off.

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