CMP products

CMP products

  • CN 100,396,749 C
  • Filed: 08/30/2000
  • Issued: 06/25/2008
  • Est. Priority Date: 10/06/1999
  • Status: Active Grant
First Claim
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1. chemical mechanical planarization method, it comprises the base material that uses the abrasive polishing that contains aluminum oxide powder to comprise metal and non-conducting material, the particle that it is characterized in that described aluminum oxide powder has silica dioxide coating, and the BET surface-area of described aluminum oxide powder is at least 50m 2/ gm, alumina content are at least 90 weight %, and Alpha-alumina content is at least 90 weight %, and wherein the final particle width of at least 90% alumina particle is not more than 50nm, and final size is less than 10% greater than the particle of 100nm.

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