EMI and RFI shielding for printed circuit boards

EMI and RFI shielding for printed circuit boards

  • CN 100,403,864 C
  • Filed: 03/28/2001
  • Issued: 07/16/2008
  • Est. Priority Date: 04/21/2000
  • Status: Active Grant
First Claim
Patent Images

1. method that shields the electronic component on the printed circuit board, this method comprises:

  • Stick on the end face of ground wire with will the metallize base portion of insulating substrate shield of conducting resinl, wherein this ground wire is set on this printed circuit board;

    AndThe top of metallization insulating substrate shield is attached on the base portion of this metallization insulating substrate shield removedly, to surround described electronic component;

    Wherein, when this top was removed with the described electronic component of permission contact, this base portion remained adhered on this ground wire, and does not need to disconnect the electrical conductivity of this shield and this ground wire.

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