Bond pad structure

Bond pad structure

  • CN 100,517,668 C
  • Filed: 06/02/2005
  • Issued: 07/22/2009
  • Est. Priority Date: 11/02/2004
  • Status: Active Grant
First Claim
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1. , a kind of joint sheet structure, described joint sheet structure comprises:

  • One the first metal layer is formed on the ic substrate;

    One joint sheet layer is positioned on this first metal layer and is electrically connected at this first metal layer;

    One stress-buffer layer, between this first metal layer and this joint sheet layer, wherein the young'"'"'s modulus of this stress-buffer layer, hardness, intensity or toughness are greater than young'"'"'s modulus, hardness, intensity or the toughness of this first metal layer or this joint sheet layer;

    AndOne protective layer is formed on this first metal layer, and this protective layer includes one first hole, so that come out to this first metal layer of small part;

    Wherein this stress-buffer layer is formed among this first hole, and this stress-buffer layer comprises at least one second hole less than this first hole, so that come out to this first metal layer of small part;

    Wherein this joint sheet layer is formed on this stress-buffer layer and fills up this second hole.

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