ELECTROPLATE TECHNOLOGY

ELECTROPLATE TECHNOLOGY

  • CN 1,005,278 B
  • Filed: 02/27/1988
  • Issued: 09/27/1989
  • Est. Priority Date: 02/27/1988
  • Status: Active Grant
First Claim
Patent Images

1. an electroplate technology, in its electroplating production device, be provided with plating tank and rinse bath, it is characterized in that, also be provided with reservoir, reservoir is positioned at the top of coating bath, the number of rinse bath used is 4~

  • 6, between coating bath and each rinse bath, be connected with soft plastics, in Electroplating Production, rinse bath is turned over to groove with the cycle of determining, produce while reaching sometime the cycle, scavenging solution in the first rinse bath 3 is introduced to reservoir, again the scavenging solution in the second rinse bath 4 is introduced to the first rinse bath, introduce so successively, until the scavenging solution of last rinse bath is introduced to penultimate rinse bath, finally in last rinse bath that draws sky, add dried up son (or distilled water) with additional clean liquid, every one-period of crossing carries out such turning over groove once, the liquid of introducing storage fluid bowl supplements as required in coating bath, and in one-period, the scavenging solution of once introducing is all added in coating bath, steam-heated cal(l)andria pipeline is all housed in coating bath and reservoir, in the time that the working temperature of plating solution in coating bath is room temperature, heat reservoir, Heating temperature is 40~

    50 ℃

    , in the time that the working temperature of plating solution in coating bath is 40~

    50 ℃

    , do not heat reservoir, compressed air line is all equipped with in the bottom of each rinse bath, cleaning in the process of plating piece with a certain amount of without oily anhydrous pressurized air stirring and washing liquid.

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