A kind of integrated intercommunication module reaches the intercom system based on this module

A kind of integrated intercommunication module reaches the intercom system based on this module

CN
  • CN 100,562,143 C
  • Filed: 09/17/2007
  • Issued: 11/18/2009
  • Est. Priority Date: 09/17/2007
  • Status: Active Grant
First Claim
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1. an integrated intercommunication module is characterized in that, described integrated intercommunication module comprises radio frequency receiving unit (1), radio-frequency transmissions part (2) and base band signal process part (3);

  • Described radio frequency receiving unit (1) is used for received RF signal and demodulation output voice signal and signaling-information to base band signal process part (3);

    Described base band signal process part (3) is used for the voice signal and the signaling-information of described demodulation output are carried out exporting after the Base-Band Processing, also is used for carrying out outputing to described radio-frequency transmissions part (2) after the Base-Band Processing sending voice signal and signaling-information;

    Described radio-frequency transmissions part (2) is the radiating circuit of direct phase-locked loop frequency comprehensive form, this circuit comprises;

    warble rate adjuster (21), fractional phase lock loop frequency synthesizer (22) and power amplifier (23), described warble rate adjuster (21) are used for the voice signal of input and signaling-information are carried out the warble rate adjusting;

    Described fractional phase lock loop frequency synthesizer (22) is used for that frequency modulation depth adjuster (21) is regulated the signal of exporting the back and finishes digital direct frequency modulation modulation, produces the rf modulations carrier signal;

    Described power amplifier (23) is used for described rf modulations carrier signal is carried out exporting after the power amplification;

    Described radio frequency receiving unit (1), radio-frequency transmissions part (2) and base band signal process part (3) adopt Digital Signal Processing and are integrated on the chip piece by CMOS technology.

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