Conductive paste and method for manufacturing multilayer printed wiring board using same

Conductive paste and method for manufacturing multilayer printed wiring board using same

  • CN 101,031,981 A
  • Filed: 09/26/2005
  • Published: 09/05/2007
  • Est. Priority Date: 09/30/2004
  • Status: Active Application
First Claim
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1. conductive paste, it comprises:

  • Resin compound, wherein the molecular weight in all resins component is that the content of the epoxy resin more than 10,000 is 30~

    90 weight %, described resin compound sclerosis back is below the 2GPa at 85 ℃

    modulus of elasticity, andElectroconductive particle, the content of described electroconductive particle are 30~

    75 volume %.

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