Pattern forming method and mold

Pattern forming method and mold

  • CN 101,051,183 A
  • Filed: 01/17/2007
  • Published: 10/10/2007
  • Est. Priority Date: 01/18/2006
  • Status: Active Application
First Claim
Patent Images

1. pattern formation method, with the mold compresses of pattern that formed concaveconvex shape to the substrate that has been coated with resin molding, thereby this relief pattern is transferred on the substrate surface, it is characterized in that:

  • Described mould has the alignment mark that is used for determining the relative position relation between substrate and the mould more than 2 on the concentric circles, utilize the relative position relation between the end of described alignment mark and substrate circular open portion, carry out the position alignment between mould and the substrate.

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