Flip-chip system and method of making same

Flip-chip system and method of making same

  • CN 101,061,577 A
  • Filed: 10/23/2003
  • Published: 10/24/2007
  • Est. Priority Date: 10/24/2002
  • Status: Active Application
First Claim
Patent Images

1. package system comprises:

  • Flip-chip on the substrate is installed;

    Underfill mixture between described flip-chip and the described installation substrate, wherein said underfill mixture comprises main underfill composite, described main underfill composite is selected from silsesquioxane, thermosetting liquid crystal monomer, and their combination.

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