Chemical copper plating solution and technique thereof

Chemical copper plating solution and technique thereof

  • CN 101,078,111 A
  • Filed: 05/26/2006
  • Published: 11/28/2007
  • Est. Priority Date: 05/26/2006
  • Status: Active Application
First Claim
Patent Images

1. chemical copper plating solution, it mainly comprises following component, is expressed as with parts by weight:

  • Salzburg vitriol 0.8-3Seven ferric sulfate hydrate 0-0.5Complexing agent 3-6Sodium hypophosphite 4-6Ammonium sulfate 0.5-1Thiocarbamide 0-0.01.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×