Thin film removing method and apparatus

Thin film removing method and apparatus

  • CN 101,078,891 A
  • Filed: 05/22/2006
  • Published: 11/28/2007
  • Est. Priority Date: 05/22/2006
  • Status: Active Application
First Claim
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1. the sweep-out method of a film is removed an on-chip film, it is characterized in that the sweep-out method of this film comprises:

  • An one electricity slurry generator and an air extractor is set above this substrate;

    AndAdjust this electricity slurry generator, the electricity slurry bundle oblique fire that makes its ejaculation is on this film, and this air extractor is located on should the reflection paths of electricity slurry bundle, absorbs this film after the reaction of electricity slurry, and unreacted fully and the accessory substance that produces keeps the cleaning of this substrate surface.

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