Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use

Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use

  • CN 101,083,234 B
  • Filed: 05/28/2007
  • Issued: 06/19/2013
  • Est. Priority Date: 05/26/2006
  • Status: Active Grant
First Claim
Patent Images

1. semiconductor structure that assembles comprises:

  • Thermal source;

    Low-temperature receiver;

    Carry the expansion structure of heat;

    The carbon nano pipe array of the first and second marshallings spaced apart from each other, described the first and second carbon nano pipe arrays surface heat relative with two of described expansion structure respectively connect;

    Wherein said the first carbon nano pipe array terminates on thermal source, and an end of described the second carbon nano pipe array is connected on low-temperature receiver;

    WithThe periphery connecting material, described peripheral connecting material only is applied at least some edges of the carbon nano pipe array of described marshalling, the described thermal source of while Mechanical Contact, described low-temperature receiver and described expansion structure, thereby position relationship fixing between described thermal source and described expansion structure and described expansion structure and described low-temperature receiver is provided, avoids because using tack coat additionally to increase thermal resistance.

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