Semiconductor device with embedded heat spreader

Semiconductor device with embedded heat spreader

  • CN 101,095,225 A
  • Filed: 12/29/2005
  • Published: 12/26/2007
  • Est. Priority Date: 12/30/2004
  • Status: Active Application
First Claim
Patent Images

1. device comprises:

  • Elastomer layer;

    Ribbon lead is attached to described elastomer layer;

    Polymer resin is attached to described ribbon lead;

    AndThermal conductive substrate is attached to described polymer resin, described thermal conductive substrate dissipate heat.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×