Adsorptive pad of fixed element to be polished and manufacturing method thereof

Adsorptive pad of fixed element to be polished and manufacturing method thereof

  • CN 101,100,043 B
  • Filed: 07/03/2006
  • Issued: 01/11/2012
  • Est. Priority Date: 07/03/2006
  • Status: Active Grant
First Claim
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1. the adsorptivity pad of a fixing polished element comprises:

  • One ground has a surface, and the material of said ground is the PU resin of high solid composition, and its thickness is greater than 0.5mm, and the inside of said ground has a plurality of holes;

    One top layer is positioned on the surface of said ground, and the inside on said top layer does not have the hole structure, and said top layer has a surface, the PU resin of the material on said top layer for not foaming, and its thickness is less than the thickness of said ground;

    WithOne little buckle layer is positioned on the surface on said top layer, in order to carry and fixing said polished element;

    The inside of said little buckle layer does not have the hole structure, the PU resin of the material of said little buckle layer for not foaming, and said little buckle layer forms for printing;

    Said little buckle layer has a plurality of raised structures;

    Form an exhaust space between wherein any two raised structures, when said polished element contacted with said little buckle layer, air therebetween can be discharged via said exhaust space smoothly.

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