Method of mounting electronic components

Method of mounting electronic components

  • CN 101,120,441 A
  • Filed: 09/22/2006
  • Published: 02/06/2008
  • Est. Priority Date: 09/30/2005
  • Status: Active Application
First Claim
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1. one kind is used for electronic component is installed in electronic component mounting method on the circuit board, wherein by using the scolder that Sn makes or making the Au projection that is arranged on the electronic component scolder that comprises Sn and engage the terminal joint, and described electronic component is bonded on the circuit board by thermosetting resin, and then described electronic component is installed on the circuit board, described method comprises:

  • Apply operation comprising the resin that applies thermosetting resin on the zone that engages terminal on the circuit board surface, described resin comprises the solder particle that forms by the granulation scolder;

    Under the state that described electronic component is kept by the maintenance head with heating function, carry out the Au projection and engage the positioning process of locating between the terminal;

    Reduce to keep head and utilize keeping the head described electronic component of heating and then making Au projection and the bump bonds operation that engages the terminal joint;

    AndHot curing thermosetting resin and then described electronic component is bonded in hardening of resin operation on the circuit board,Wherein, in described bump bonds operation, the thermosetting resin that applies flows towards the outside by the lower surface of electronic component, the solder particle that comprises in the thermosetting resin contacts with the lower surface of the Au projection that is heated above the scolder melting temperature by keeping head, and the solder particle of part is melted under the state that is sandwiched between Au projection and the joint terminal.

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