An integrated circuit package device with improved bond pad connections, a leadframe and an electronic device

An integrated circuit package device with improved bond pad connections, a leadframe and an electronic device

  • CN 101,142,675 A
  • Filed: 02/15/2006
  • Published: 03/12/2008
  • Est. Priority Date: 02/23/2005
  • Status: Active Application
First Claim
Patent Images

1. one kind has the semiconductor packages of rectangular shape (10) in fact, comprising:

  • Die attach pads (12) has top surface (14) and lower surface (16);

    A plurality of contact pads (26 1-26 n), in the corresponding four lines at least of the rectangular shape that is arranged on and encapsulates, each contact pad has top surface and top surface;

    At least two connecting rods (18) are used to support die attach pads up to till cutting encapsulation during the encapsulation manufacturing, and described connecting rod has top surface and lower surface, and extends to the corner of encapsulation from die attach pads;

    Semiconductor element (20) is installed in die attach pads (12) top surface (14) and goes up, also is formed with bond pad (44) thereon;

    A plurality of electrical connections (22,24) are at selected some bond pads (44) and more corresponding contact pads (26 1-26 n) between;

    Encapsulant (28), the top surface and the contact pad (26 of the top surface (14) of parcel semiconductor element (20), die attach pads (12), electrical connection (22,24), connecting rod (18) 1-26 n) top surface, and outside the lower surface that stays the lower surface (16) of die attach pads and contact pad is exposed to;

    It is characterized in that;

    At least one rectangular (30) with top surface (32) and lower surface (34) is arranged between the contact pad of die attach pads (12) and corresponding line, described rectangular at least one side direction part (36) that is connected with at least one contact pad in the described row that has provides and is electrically connected on rectangular and semiconductor element (20) with between the rectangular adjacent selected pad (44).

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