Peeling apparatus and manufacturing method of semiconductor device

Peeling apparatus and manufacturing method of semiconductor device

  • CN 101,154,561 B
  • Filed: 09/29/2007
  • Issued: 04/22/2015
  • Est. Priority Date: 09/29/2006
  • Status: Active Grant
First Claim
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1. a stripping off device, peel off from substrate the layer formed over the substrate, comprising:

  • First cylinder, for being attached to film by the laminating comprising works be formed on substrate;

    First conveyer belt, for mobile described substrate, wherein said first conveyer belt and described first rolling drum surface are to each other;

    Second tin roller, for generating the stripping between described substrate and described layer, and is transferred to described film by described layer;

    Second conveyer belt, for mobile described substrate, wherein said second conveyer belt and described second tin roller are towards each other;

    AndThe tank of receiving fluids, in described tank, comprises space between the layer of works and described substrate to comprise the stripping of layer from described substrate of works described in producing described in liquid is supplied to,Wherein described substrate is made to move to described tank by the rotation of described second conveyer belt and described first conveyer belt,Wherein said first cylinder and described first conveyer belt are provided outside described tank, andThe wherein said part be peeling comprising the layer of works is in described tank.

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