Multi-chip module and method of manufacture

Multi-chip module and method of manufacture

  • CN 101,171,683 A
  • Filed: 04/26/2006
  • Published: 04/30/2008
  • Est. Priority Date: 05/04/2005
  • Status: Active Application
First Claim
Patent Images

1. a method that is used to make multi-chip module (10) comprises the following steps:

  • Support substrates (12) with the first main surface (14) and second main surface (16) is provided, and wherein this support substrates (10) has chip reception area (38) and a plurality of joint sheets (18,20);

    First semiconductor chip (40) is connected to this chip reception area (38), and this first semiconductor chip (40) has a plurality of joint sheets (46);

    First joint sheet (46A) in these a plurality of joint sheets (46) of this first semiconductor chip (40) is connected to first joint sheet (18A) in these a plurality of joint sheets (18,20) of this support substrates (12);

    Distance piece (50) is connected to the part of this first semiconductor chip (40);

    Backing material (60) is configured at least on one of them of this distance piece (50) or this first semiconductor chip (40);

    Second semiconductor chip (64) is positioned on this backing material (60), this second semiconductor chip (64) has the first main surface (68) and a plurality of joint sheets (70), wherein locatees the step of this second semiconductor chip (64) and pushes this backing material (60) in horizontal direction;

    AndFirst joint sheet (70A) in these a plurality of joint sheets (70) of this second semiconductor chip (64) is connected to second joint sheet (20A) in this a plurality of joint sheets (20) of this support substrates (12).

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