Molding apparatus for resin encapsulation of electronic part

Molding apparatus for resin encapsulation of electronic part

  • CN 101,180,170 B
  • Filed: 10/17/2006
  • Issued: 08/07/2013
  • Est. Priority Date: 11/04/2005
  • Status: Active Grant
First Claim
Patent Images

1. the molding apparatus for resin encapsulation of an electronic device is characterized in that, comprising:

  • The die assembly (1,2,3) of the resin encapsulation shaping usefulness of electronic device, it comprises patrix (1) and counterdie (2), described patrix (1) is installed for the substrate (36) that is equiped with electronic device (35), described counterdie (2) has the die cavity spatial portion (9) that holds described electronic device, at described patrix (1) and described counterdie (2) when being closed, described electronic device (35) is submerged in the resin material (41) of the fusion in the described die cavity spatial portion (9), andResin feed mechanism (40), it supplies with powdery or granular resin material (41) to described die cavity spatial portion (9),Described resin feed mechanism portion (40) comprising;

    Storage portion (43), it stores described resin material;

    Metering portion (44), it takes out the resin material (41) of requirement in resin material (41) from be stored at described storage portion (43) by metering;

    Guide portion (45), its resin material with described requirement (41) are to resin disk (42) guiding, and described resin disk (42) comprises the slit parts (42B) of a plurality of linearity openings that having is parallel to each other extends;

    AndSupply unit (46), it has described resin disk (42) and gate (42A), this gate (42A) can be under described resin disk (42) opens and closes in the direction with the bearing of trend approximate vertical of described a plurality of linearity openings, the resin material (41) of described requirement is supplied with to described die cavity spatial portion (9) when opening at described gate (42A)Described guide portion (45) comprises guiding slit parts (45B), this guiding has a plurality of linearity openings corresponding with described a plurality of linearity openings of described slit parts (42B) with slit parts (45B), under the state that moves continuously, the resin material (41) of described requirement is fallen according to the resin material (41) of described requirement in described resin disk (42) to described a plurality of linearity openings of described dish with slit parts (42B) from described a plurality of linearity openings of described guiding with slit parts (45B).

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