Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity

Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity

  • CN 101,200,800 A
  • Filed: 11/12/2007
  • Published: 06/18/2008
  • Est. Priority Date: 11/13/2006
  • Status: Active Application
First Claim
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1. be used for the dynamically powdered mixture of spraying, be grouped into by following one-tenth basically:

  • One or more following materials;

    tin-silver-copper (Sn-Ag-Cu), tin-copper (Sn-Cu), tin-copper-nickel (Sn-Cu-Ni), Xi-Yin (Sn-Ag), Xi-Yin-bismuth (Sn-Ag-Bi), Sn-Bi-indium (Sn-Bi-In), Xi-Jin (Au-Sn), tin-zinc (Sn-Zn), tin-zinc-bismuth (Sn-Zn-Bi), Sn-Bi-Yin (Sn-Bi-Ag), tin (Sn), tin-indium (Sn-In), indium (In), indium-Yin (In-Ag) and tin-lead (Sn-Pb);

    AndPacking material with high heat conduction and electroconductibility, it has following material one or more;

    the carbon of copper (Cu), gold (Au), nickel (Ni), nickel-Jin (Ni-Au), carbon, silver (Ag), aluminium (Al), molybdenum (Mo), nickel (Ni) or nickel-Jin (Ni-Au) coating, platinum metals (PGM '"'"' s), and their alloy.

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