Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity
Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity
- CN 101,200,800 A
- Filed: 11/12/2007
- Published: 06/18/2008
- Est. Priority Date: 11/13/2006
- Status: Active Application
- EN CH
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- Pin
