Integrated circuit structure forming method

Integrated circuit structure forming method

  • CN 101,217,122 A
  • Filed: 05/23/2007
  • Published: 07/09/2008
  • Est. Priority Date: 01/03/2007
  • Status: Active Application
First Claim
Patent Images

1. the formation method of an integrated circuit structure comprises following steps:

  • Packaging body is provided, and it has upper surface;

    A plurality of slicken solder spheres are placed this upper surface of this packaging body;

    Placement copline surface makes it lean on described a plurality of slicken solder sphere, and wherein this copline surface does not have adherence;

    Described a plurality of slicken solder spheres are carried out reflow, and make the upper surface of described a plurality of slicken solder spheres be essentially copline;

    AndRemove this copline surface.

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