Solid imaging element and manufacturing method thereof

Solid imaging element and manufacturing method thereof

  • CN 101,228,631 A
  • Filed: 06/01/2006
  • Published: 07/23/2008
  • Est. Priority Date: 06/02/2005
  • Status: Active Application
First Claim
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1. a semiconductor image sensor module is characterized in that, laminated have first semiconductor chip and second semiconductor chip,Described first semiconductor chip, it possesses the imageing sensor that the rule assortments of a plurality of pixels and described each pixel are made of photo-electric conversion element and transistor;

  • Described second semiconductor chip, it possesses the A/D converter array that is made of a plurality of A/D converters.

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