Method for handling adhesive laminate sections

Method for handling adhesive laminate sections

  • CN 101,232,875 A
  • Filed: 06/08/2006
  • Published: 07/30/2008
  • Est. Priority Date: 06/10/2005
  • Status: Active Application
First Claim
Patent Images

1. method of handling adhesive laminate comprises:

  • Provide and the strippingly adherent adhesive laminate of first tablet;

    Wherein said adhesive laminate comprises a plurality of cuttings or punching fragment, and the adjacent segment of wherein said adhesive laminate by one or more junction points tablet vertically on keep being connected to each other;

    First supporting construction is provided;

    With first Web guide on first supporting construction;

    Second supporting construction adjacent with first supporting construction is provided;

    Second tablet with release surface is provided;

    On described second supporting construction, wherein second tablet is oriented with second Web guide, makes the release surface of second tablet face first supporting construction;

    To be bonded to the release surface of second tablet from the first segmental fore-end of the adhesive laminate of first tablet;

    WithSecond tablet is advanced, make second fragment of first fragment of described adhesive laminate and adhesive laminate from disconnected, and structure bond to the second tablet that separates with the first segmental trailing edge with described adhesive laminate of the second segmental leading edge of adhesive laminate.

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